JPS5710513A - Airtight sealing method for quartz oscillator - Google Patents
Airtight sealing method for quartz oscillatorInfo
- Publication number
- JPS5710513A JPS5710513A JP8491980A JP8491980A JPS5710513A JP S5710513 A JPS5710513 A JP S5710513A JP 8491980 A JP8491980 A JP 8491980A JP 8491980 A JP8491980 A JP 8491980A JP S5710513 A JPS5710513 A JP S5710513A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- soft
- melting point
- low melting
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 title abstract 3
- 238000007789 sealing Methods 0.000 title abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 abstract 10
- 239000002184 metal Substances 0.000 abstract 10
- 230000008018 melting Effects 0.000 abstract 5
- 238000002844 melting Methods 0.000 abstract 5
- 238000009736 wetting Methods 0.000 abstract 4
- 239000010408 film Substances 0.000 abstract 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- 101100116973 Mus musculus Dmbt1 gene Proteins 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
PURPOSE:To increase the reliability for airtight sealing and the performance of quartz oscillator and to enable the cost down, by sicking a soft low melting point metal on a metal having worse wetting properties with the soft low melting point metal and transferring the soft low melting point metal in the sealing hole. CONSTITUTION:On the surface of a tool 11 consisting of plate-shaped metal or insulating member, a soft low melting point metal, e.g. a chromium thin film 12 which has worse adhesive strength with solder, is stuck, and another metal 13 having soft and low melting point is stuck on it. A terminal 15 has one hole 16 having different upper and lower hole diameters for one quartz bar, and a thin metallic film 17 having good wetting properties with the soft metal 13, such as CrAu, CrPd is stuck on the surface. Further, the tool 11 and the thin metallic film 17 having good wetting properties with the terminal 15 are overlapped after alignment, and when an external pressure is exerted between the members 11 and 17 so that the surface pressure can be exerted and detached after heating, the metal 17 having good wetting properties near the hole 16 and the soft metal 13 react and bond with each other, and the hole 16 is bonded and sealed airtightly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8491980A JPS5710513A (en) | 1980-06-23 | 1980-06-23 | Airtight sealing method for quartz oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8491980A JPS5710513A (en) | 1980-06-23 | 1980-06-23 | Airtight sealing method for quartz oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5710513A true JPS5710513A (en) | 1982-01-20 |
Family
ID=13844113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8491980A Pending JPS5710513A (en) | 1980-06-23 | 1980-06-23 | Airtight sealing method for quartz oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5710513A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH655423GA3 (en) * | 1984-02-15 | 1986-04-30 | ||
| US20100251527A1 (en) * | 2008-02-01 | 2010-10-07 | Epson Toyocom Corporation | Piezoelectric device and method for manufacturing the same |
-
1980
- 1980-06-23 JP JP8491980A patent/JPS5710513A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH655423GA3 (en) * | 1984-02-15 | 1986-04-30 | ||
| US20100251527A1 (en) * | 2008-02-01 | 2010-10-07 | Epson Toyocom Corporation | Piezoelectric device and method for manufacturing the same |
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