JPS57106230U - - Google Patents
Info
- Publication number
- JPS57106230U JPS57106230U JP1980183158U JP18315880U JPS57106230U JP S57106230 U JPS57106230 U JP S57106230U JP 1980183158 U JP1980183158 U JP 1980183158U JP 18315880 U JP18315880 U JP 18315880U JP S57106230 U JPS57106230 U JP S57106230U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980183158U JPS57106230U (mo) | 1980-12-22 | 1980-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980183158U JPS57106230U (mo) | 1980-12-22 | 1980-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57106230U true JPS57106230U (mo) | 1982-06-30 |
Family
ID=29982168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980183158U Pending JPS57106230U (mo) | 1980-12-22 | 1980-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57106230U (mo) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5081475A (mo) * | 1973-11-19 | 1975-07-02 |
-
1980
- 1980-12-22 JP JP1980183158U patent/JPS57106230U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5081475A (mo) * | 1973-11-19 | 1975-07-02 |