JPS57114663A - Cylindrical magnetron sputtering cathode and sputtering apparatus equipped therewith - Google Patents

Cylindrical magnetron sputtering cathode and sputtering apparatus equipped therewith

Info

Publication number
JPS57114663A
JPS57114663A JP56124637A JP12463781A JPS57114663A JP S57114663 A JPS57114663 A JP S57114663A JP 56124637 A JP56124637 A JP 56124637A JP 12463781 A JP12463781 A JP 12463781A JP S57114663 A JPS57114663 A JP S57114663A
Authority
JP
Japan
Prior art keywords
face
sputtering
cathode
arch
magnet assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56124637A
Other languages
English (en)
Inventor
Zega Botsugudan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Battelle Development Corp
Original Assignee
Battelle Development Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Battelle Development Corp filed Critical Battelle Development Corp
Publication of JPS57114663A publication Critical patent/JPS57114663A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Microwave Tubes (AREA)
  • Photoreceptors In Electrophotography (AREA)
JP56124637A 1980-08-08 1981-08-08 Cylindrical magnetron sputtering cathode and sputtering apparatus equipped therewith Pending JPS57114663A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP80200753A EP0045822B1 (en) 1980-08-08 1980-08-08 Cylindrical magnetron sputtering cathode

Publications (1)

Publication Number Publication Date
JPS57114663A true JPS57114663A (en) 1982-07-16

Family

ID=8187028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56124637A Pending JPS57114663A (en) 1980-08-08 1981-08-08 Cylindrical magnetron sputtering cathode and sputtering apparatus equipped therewith

Country Status (6)

Country Link
US (1) US4407713A (ja)
EP (1) EP0045822B1 (ja)
JP (1) JPS57114663A (ja)
AT (1) ATE13561T1 (ja)
CA (1) CA1169467A (ja)
DE (1) DE3070700D1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015076162A1 (ja) * 2013-11-22 2015-05-28 東レ株式会社 プラズマ電極、プラズマ処理電極、ｃｖｄ電極、プラズマｃｖｄ装置及び薄膜付基材の製造方法
JP2022502853A (ja) * 2018-09-28 2022-01-11 パワー ロール リミテッド エネルギー貯蔵装置用の基板を処理する方法

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US4376025A (en) * 1982-06-14 1983-03-08 Battelle Development Corporation Cylindrical cathode for magnetically-enhanced sputtering
GB2125441A (en) * 1982-07-13 1984-03-07 Christopher Elphick Tunnel magnetron for cathode sputtering
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US4606806A (en) * 1984-05-17 1986-08-19 Varian Associates, Inc. Magnetron sputter device having planar and curved targets
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US7867366B1 (en) * 2004-04-28 2011-01-11 Alameda Applied Sciences Corp. Coaxial plasma arc vapor deposition apparatus and method
WO2006007504A1 (en) * 2004-07-01 2006-01-19 Cardinal Cg Company Cylindrical target with oscillating magnet from magnetron sputtering
US20060065524A1 (en) * 2004-09-30 2006-03-30 Richard Newcomb Non-bonded rotatable targets for sputtering
US20060076231A1 (en) * 2004-10-12 2006-04-13 Southwest Research Institute Method for magnetron sputter deposition
US7790003B2 (en) * 2004-10-12 2010-09-07 Southwest Research Institute Method for magnetron sputter deposition
US7520965B2 (en) * 2004-10-12 2009-04-21 Southwest Research Institute Magnetron sputtering apparatus and method for depositing a coating using same
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US7592051B2 (en) * 2005-02-09 2009-09-22 Southwest Research Institute Nanostructured low-Cr Cu-Cr coatings for high temperature oxidation resistance
US20060207871A1 (en) 2005-03-16 2006-09-21 Gennady Yumshtyk Sputtering devices and methods
US20060278519A1 (en) * 2005-06-10 2006-12-14 Leszek Malaszewski Adaptable fixation for cylindrical magnetrons
US20060278521A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for controlling ion density and energy using modulated power signals
US20060278524A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for modulating power signals to control sputtering
PL1775353T3 (pl) * 2005-09-15 2009-04-30 Applied Mat Gmbh & Co Kg Urządzenie powlekające i sposób eksploatacji urządzenia powlekającego
US8123919B2 (en) * 2005-09-20 2012-02-28 Guardian Industries Corp. Sputtering target with bonding layer of varying thickness under target material
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US7842355B2 (en) * 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
US20070095281A1 (en) * 2005-11-01 2007-05-03 Stowell Michael W System and method for power function ramping of microwave liner discharge sources
JP5355382B2 (ja) * 2006-03-28 2013-11-27 スルザー メタプラス ゲーエムベーハー スパッタリング装置
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US8652310B2 (en) * 2008-07-24 2014-02-18 Seagate Technology Llc Trim magnets to adjust erosion rate of cylindrical sputter targets
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CN101899642B (zh) * 2009-05-25 2013-03-20 鸿富锦精密工业（深圳）有限公司 镀膜装置
CN101956170B (zh) * 2009-07-15 2013-12-11 鸿富锦精密工业（深圳）有限公司 磁控溅射靶
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CN102719799A (zh) * 2012-06-08 2012-10-10 深圳市华星光电技术有限公司 旋转磁控溅射靶及相应的磁控溅射装置
US9640359B2 (en) 2012-08-09 2017-05-02 Vactronix Scientific, Inc. Inverted cylindrical magnetron (ICM) system and methods of use
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US9546837B1 (en) 2015-10-09 2017-01-17 Bh5773 Ltd Advanced gun barrel
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CN110408902A (zh) * 2019-08-22 2019-11-05 深圳市金耀玻璃机械有限公司 一种绕线式电弧靶装置
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JP7737830B2 (ja) * 2021-06-25 2025-09-11 東京エレクトロン株式会社 成膜装置、処理条件決定方法及び成膜方法
CN115491645A (zh) * 2022-09-19 2022-12-20 中核四0四有限公司 一种基于磁控溅射的镀膜系统及方法
CN119121163B (zh) * 2024-11-11 2025-02-25 中国科学院赣江创新研究院 一种中空磁控溅射阴极、磁控溅射镀膜装置及镀膜方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015076162A1 (ja) * 2013-11-22 2015-05-28 東レ株式会社 プラズマ電極、プラズマ処理電極、ｃｖｄ電極、プラズマｃｖｄ装置及び薄膜付基材の製造方法
JPWO2015076162A1 (ja) * 2013-11-22 2017-03-16 東レ株式会社 プラズマ電極、プラズマ処理電極、ｃｖｄ電極、プラズマｃｖｄ装置及び薄膜付基材の製造方法
JP2022502853A (ja) * 2018-09-28 2022-01-11 パワー ロール リミテッド エネルギー貯蔵装置用の基板を処理する方法

Also Published As

Publication number Publication date
EP0045822B1 (en) 1985-05-29
CA1169467A (en) 1984-06-19
ATE13561T1 (de) 1985-06-15
US4407713A (en) 1983-10-04
DE3070700D1 (en) 1985-07-04
EP0045822A1 (en) 1982-02-17

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