JPS57128147U - - Google Patents
Info
- Publication number
- JPS57128147U JPS57128147U JP1981013828U JP1382881U JPS57128147U JP S57128147 U JPS57128147 U JP S57128147U JP 1981013828 U JP1981013828 U JP 1981013828U JP 1382881 U JP1382881 U JP 1382881U JP S57128147 U JPS57128147 U JP S57128147U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Electric Clocks (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981013828U JPS57128147U (ja) | 1981-02-03 | 1981-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981013828U JPS57128147U (ja) | 1981-02-03 | 1981-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57128147U true JPS57128147U (ja) | 1982-08-10 |
Family
ID=29811900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981013828U Pending JPS57128147U (ja) | 1981-02-03 | 1981-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57128147U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022145094A1 (ja) * | 2020-12-28 | 2022-07-07 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259571A (en) * | 1975-11-11 | 1977-05-17 | Oki Electric Ind Co Ltd | Substrate for face down bonding |
| JPS5279872A (en) * | 1975-12-26 | 1977-07-05 | Seiko Epson Corp | Bonding substrate |
| JPS53147262A (en) * | 1977-05-30 | 1978-12-21 | Hitachi Ltd | Thick film circuit board |
-
1981
- 1981-02-03 JP JP1981013828U patent/JPS57128147U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259571A (en) * | 1975-11-11 | 1977-05-17 | Oki Electric Ind Co Ltd | Substrate for face down bonding |
| JPS5279872A (en) * | 1975-12-26 | 1977-07-05 | Seiko Epson Corp | Bonding substrate |
| JPS53147262A (en) * | 1977-05-30 | 1978-12-21 | Hitachi Ltd | Thick film circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022145094A1 (ja) * | 2020-12-28 | 2022-07-07 |