JPS57138148A - Wire bonding method for integrated circuit - Google Patents

Wire bonding method for integrated circuit

Info

Publication number
JPS57138148A
JPS57138148A JP56022916A JP2291681A JPS57138148A JP S57138148 A JPS57138148 A JP S57138148A JP 56022916 A JP56022916 A JP 56022916A JP 2291681 A JP2291681 A JP 2291681A JP S57138148 A JPS57138148 A JP S57138148A
Authority
JP
Japan
Prior art keywords
focus
marks
pellet
optical system
signals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56022916A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6248894B2 (mo
Inventor
Makoto Ariga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56022916A priority Critical patent/JPS57138148A/ja
Publication of JPS57138148A publication Critical patent/JPS57138148A/ja
Publication of JPS6248894B2 publication Critical patent/JPS6248894B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Wire Bonding (AREA)
JP56022916A 1981-02-20 1981-02-20 Wire bonding method for integrated circuit Granted JPS57138148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56022916A JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56022916A JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Publications (2)

Publication Number Publication Date
JPS57138148A true JPS57138148A (en) 1982-08-26
JPS6248894B2 JPS6248894B2 (mo) 1987-10-16

Family

ID=12095960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56022916A Granted JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Country Status (1)

Country Link
JP (1) JPS57138148A (mo)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector

Also Published As

Publication number Publication date
JPS6248894B2 (mo) 1987-10-16

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