JPS57140601A - Laminate type evaporator - Google Patents
Laminate type evaporatorInfo
- Publication number
- JPS57140601A JPS57140601A JP2732281A JP2732281A JPS57140601A JP S57140601 A JPS57140601 A JP S57140601A JP 2732281 A JP2732281 A JP 2732281A JP 2732281 A JP2732281 A JP 2732281A JP S57140601 A JPS57140601 A JP S57140601A
- Authority
- JP
- Japan
- Prior art keywords
- solder material
- aluminum
- laminate type
- type evaporator
- bismuth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 abstract 7
- 229910000679 solder Inorganic materials 0.000 abstract 7
- 229910052797 bismuth Inorganic materials 0.000 abstract 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052782 aluminium Inorganic materials 0.000 abstract 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 3
- 230000007797 corrosion Effects 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 abstract 2
- 229910000838 Al alloy Inorganic materials 0.000 abstract 1
- 241001163841 Albugo ipomoeae-panduratae Species 0.000 abstract 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005219 brazing Methods 0.000 abstract 1
- 239000011162 core material Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
Abstract
PURPOSE: To enhance the solderability of the laminate type evaporator without losing corrosion resistance thereof by adding bismuth to a solder material in the laminate type evaporator constituted from aluminum or an aluminum alloy.
CONSTITUTION: A solder material containing bismuth is clad on the inner surface of a molded plate 1 and a solder material containing no bismuth on the outer surface thereof to prevent the generation of white rust due to corrosion on the outer surface thereof even if water is condensed thereon and to make the flowability of a contact surface well on the inner surface thereof. That is, an aluminum core material 10 is used as a brazing sheet and, as the solder material 11 of the upper surface thereof, one consisting of 10% Si, 1.5% Mg and the remainder aluminum is used and, as the solder material 12, one consisting of 10% Si, 1.5% Mg, 0.1% Bi and the remainder aluminum is used and these sheets are molded by press processing so as to form the side of the solder material 11 as an outer surface and the side of the solder material 12 as an inner surface.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2732281A JPS57140601A (en) | 1981-02-25 | 1981-02-25 | Laminate type evaporator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2732281A JPS57140601A (en) | 1981-02-25 | 1981-02-25 | Laminate type evaporator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57140601A true JPS57140601A (en) | 1982-08-31 |
| JPS633711B2 JPS633711B2 (en) | 1988-01-25 |
Family
ID=12217831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2732281A Granted JPS57140601A (en) | 1981-02-25 | 1981-02-25 | Laminate type evaporator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57140601A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7080526B2 (en) * | 2004-01-07 | 2006-07-25 | Delphi Technologies, Inc. | Full plate, alternating layered refrigerant flow evaporator |
| CN112605554A (en) * | 2020-12-17 | 2021-04-06 | 东北轻合金有限责任公司 | Bismuth-containing 4-series aluminum alloy suitable for brazing flux-free brazing and preparation method thereof |
-
1981
- 1981-02-25 JP JP2732281A patent/JPS57140601A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7080526B2 (en) * | 2004-01-07 | 2006-07-25 | Delphi Technologies, Inc. | Full plate, alternating layered refrigerant flow evaporator |
| CN112605554A (en) * | 2020-12-17 | 2021-04-06 | 东北轻合金有限责任公司 | Bismuth-containing 4-series aluminum alloy suitable for brazing flux-free brazing and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS633711B2 (en) | 1988-01-25 |
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