JPS57155227A - Thermosetting binder consisting of aqueous dispersion of solid epoxide resin, manufacture and use - Google Patents
Thermosetting binder consisting of aqueous dispersion of solid epoxide resin, manufacture and useInfo
- Publication number
- JPS57155227A JPS57155227A JP2526582A JP2526582A JPS57155227A JP S57155227 A JPS57155227 A JP S57155227A JP 2526582 A JP2526582 A JP 2526582A JP 2526582 A JP2526582 A JP 2526582A JP S57155227 A JPS57155227 A JP S57155227A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- aqueous dispersion
- epoxide resin
- thermosetting binder
- binder consisting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011230 binding agent Substances 0.000 title 1
- 239000006185 dispersion Substances 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 239000007787 solid Substances 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3106529 | 1981-02-21 | ||
| DE3106529.5 | 1981-02-21 | ||
| DE3132884.9 | 1981-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57155227A true JPS57155227A (en) | 1982-09-25 |
| JPS6056731B2 JPS6056731B2 (en) | 1985-12-11 |
Family
ID=6125449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2526582A Expired JPS6056731B2 (en) | 1981-02-21 | 1982-02-20 | Thermosetting binder comprising an aqueous dispersion of solid epoxide resin and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6056731B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5938261A (en) * | 1982-08-30 | 1984-03-02 | Dainippon Ink & Chem Inc | Curable composition for coating |
| JPS61168660A (en) * | 1985-01-22 | 1986-07-30 | Saiden Kagaku Kk | Low-temperature curing resin composition |
| US5198385A (en) * | 1991-01-11 | 1993-03-30 | Harris Corporation | Photolithographic formation of die-to-package airbridge in a semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS623538U (en) * | 1985-06-19 | 1987-01-10 |
-
1982
- 1982-02-20 JP JP2526582A patent/JPS6056731B2/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5938261A (en) * | 1982-08-30 | 1984-03-02 | Dainippon Ink & Chem Inc | Curable composition for coating |
| JPS61168660A (en) * | 1985-01-22 | 1986-07-30 | Saiden Kagaku Kk | Low-temperature curing resin composition |
| US5198385A (en) * | 1991-01-11 | 1993-03-30 | Harris Corporation | Photolithographic formation of die-to-package airbridge in a semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6056731B2 (en) | 1985-12-11 |
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