JPS57155247A - Modified epoxy resin molding material - Google Patents
Modified epoxy resin molding materialInfo
- Publication number
- JPS57155247A JPS57155247A JP4062081A JP4062081A JPS57155247A JP S57155247 A JPS57155247 A JP S57155247A JP 4062081 A JP4062081 A JP 4062081A JP 4062081 A JP4062081 A JP 4062081A JP S57155247 A JPS57155247 A JP S57155247A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- modified epoxy
- bisphenol
- molding material
- type epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 7
- 229920000647 polyepoxide Polymers 0.000 title abstract 7
- 239000012778 molding material Substances 0.000 title abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003086 colorant Substances 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 239000006082 mold release agent Substances 0.000 abstract 2
- 150000002989 phenols Chemical class 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 235000021355 Stearic acid Nutrition 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 235000013312 flour Nutrition 0.000 abstract 1
- 229940018564 m-phenylenediamine Drugs 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 abstract 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000049 pigment Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000008117 stearic acid Substances 0.000 abstract 1
- 239000002023 wood Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: To prepare a modified epoxy resin molding material having high heat resistance and flexural strength and suitable for the encapsulation of a metal, at a low cost, by reacting a phenolic compound with a bisphenol A type epoxy resin.
CONSTITUTION: A modified epoxy resin prepared by the reaction of a phenolic compound with a bisphenol A type epoxy resin, is compounded with a hardener, a filler, a mold release agent, and a colorant. For example, 100pts.wt. of a modified epoxy resin derived from 94pts. of phenol and 189pts. of a bisphenol A type epoxy resin is compounded with 15pts, of a hardener (m-phenylenediamine), 75pts. of wood flour and 50pts. of silica as fillers 8pts. of a mold release agent (stearic acid), and 8pts, of a colorant (black pigment).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4062081A JPS57155247A (en) | 1981-03-19 | 1981-03-19 | Modified epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4062081A JPS57155247A (en) | 1981-03-19 | 1981-03-19 | Modified epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57155247A true JPS57155247A (en) | 1982-09-25 |
Family
ID=12585567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4062081A Pending JPS57155247A (en) | 1981-03-19 | 1981-03-19 | Modified epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57155247A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1983014A2 (en) | 2007-04-17 | 2008-10-22 | Wakol GmbH | Parquet joint kit system and method for manufacturing a parquet joint kit system |
-
1981
- 1981-03-19 JP JP4062081A patent/JPS57155247A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1983014A2 (en) | 2007-04-17 | 2008-10-22 | Wakol GmbH | Parquet joint kit system and method for manufacturing a parquet joint kit system |
| EP1983014A3 (en) * | 2007-04-17 | 2011-04-06 | Wakol GmbH | Parquet joint kit system and method for manufacturing a parquet joint kit system |
| US8074423B2 (en) | 2007-04-17 | 2011-12-13 | Wakol Gmbh | Parquet joint kit system and method for manufacturing a parquet joint kit system |
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