JPS57164550A - Electric device with improved heat radiating property - Google Patents

Electric device with improved heat radiating property

Info

Publication number
JPS57164550A
JPS57164550A JP57024473A JP2447382A JPS57164550A JP S57164550 A JPS57164550 A JP S57164550A JP 57024473 A JP57024473 A JP 57024473A JP 2447382 A JP2447382 A JP 2447382A JP S57164550 A JPS57164550 A JP S57164550A
Authority
JP
Japan
Prior art keywords
silicon carbide
beryllium oxide
silicon
property
sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57024473A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342414B2 (2
Inventor
Yasuo Matsushita
Yukio Takeda
Kosuke Nakamura
Tokio Ogoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57024473A priority Critical patent/JPS57164550A/ja
Publication of JPS57164550A publication Critical patent/JPS57164550A/ja
Publication of JPS6342414B2 publication Critical patent/JPS6342414B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57024473A 1982-02-19 1982-02-19 Electric device with improved heat radiating property Granted JPS57164550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57024473A JPS57164550A (en) 1982-02-19 1982-02-19 Electric device with improved heat radiating property

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57024473A JPS57164550A (en) 1982-02-19 1982-02-19 Electric device with improved heat radiating property

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP54142059A Division JPS5831755B2 (ja) 1979-11-05 1979-11-05 電気絶縁用基体

Publications (2)

Publication Number Publication Date
JPS57164550A true JPS57164550A (en) 1982-10-09
JPS6342414B2 JPS6342414B2 (2) 1988-08-23

Family

ID=12139130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57024473A Granted JPS57164550A (en) 1982-02-19 1982-02-19 Electric device with improved heat radiating property

Country Status (1)

Country Link
JP (1) JPS57164550A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63217648A (ja) * 1987-03-06 1988-09-09 Hitachi Ltd 発熱体の放熱構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666086A (en) * 1979-11-05 1981-06-04 Hitachi Ltd Electrically insulating board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5666086A (en) * 1979-11-05 1981-06-04 Hitachi Ltd Electrically insulating board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63217648A (ja) * 1987-03-06 1988-09-09 Hitachi Ltd 発熱体の放熱構造

Also Published As

Publication number Publication date
JPS6342414B2 (2) 1988-08-23

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