JPS57166092A - Cleaving process and cleaving device of semicnductor laser - Google Patents

Cleaving process and cleaving device of semicnductor laser

Info

Publication number
JPS57166092A
JPS57166092A JP5072781A JP5072781A JPS57166092A JP S57166092 A JPS57166092 A JP S57166092A JP 5072781 A JP5072781 A JP 5072781A JP 5072781 A JP5072781 A JP 5072781A JP S57166092 A JPS57166092 A JP S57166092A
Authority
JP
Japan
Prior art keywords
wafer
blade
unit
cleaved
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5072781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6250072B2 (fr
Inventor
Shoichi Kakimoto
Toshio Sogo
Saburo Takamiya
Shigeyuki Nitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5072781A priority Critical patent/JPS57166092A/ja
Publication of JPS57166092A publication Critical patent/JPS57166092A/ja
Publication of JPS6250072B2 publication Critical patent/JPS6250072B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Semiconductor Lasers (AREA)
JP5072781A 1981-04-03 1981-04-03 Cleaving process and cleaving device of semicnductor laser Granted JPS57166092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5072781A JPS57166092A (en) 1981-04-03 1981-04-03 Cleaving process and cleaving device of semicnductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5072781A JPS57166092A (en) 1981-04-03 1981-04-03 Cleaving process and cleaving device of semicnductor laser

Publications (2)

Publication Number Publication Date
JPS57166092A true JPS57166092A (en) 1982-10-13
JPS6250072B2 JPS6250072B2 (fr) 1987-10-22

Family

ID=12866886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5072781A Granted JPS57166092A (en) 1981-04-03 1981-04-03 Cleaving process and cleaving device of semicnductor laser

Country Status (1)

Country Link
JP (1) JPS57166092A (fr)

Also Published As

Publication number Publication date
JPS6250072B2 (fr) 1987-10-22

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