JPS5717143A - Probe for test of semiconductor wafer - Google Patents

Probe for test of semiconductor wafer

Info

Publication number
JPS5717143A
JPS5717143A JP9135680A JP9135680A JPS5717143A JP S5717143 A JPS5717143 A JP S5717143A JP 9135680 A JP9135680 A JP 9135680A JP 9135680 A JP9135680 A JP 9135680A JP S5717143 A JPS5717143 A JP S5717143A
Authority
JP
Japan
Prior art keywords
probes
section
mounting rings
sections
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9135680A
Other languages
Japanese (ja)
Other versions
JPS5834935B2 (en
Inventor
Masao Okubo
Yasuyoshi Yoshimitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP55091356A priority Critical patent/JPS5834935B2/en
Priority to US06/266,054 priority patent/US4523144A/en
Publication of JPS5717143A publication Critical patent/JPS5717143A/en
Publication of JPS5834935B2 publication Critical patent/JPS5834935B2/en
Priority to US06/613,346 priority patent/US4567433A/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To permit tests for electrodes at the peripheral section and the central section of a semiconductor chip by three dimensionally arranging probes in the radial and axial directions for mounting rings wherein the length of the prove tip section is formed to be longer than the part of the probes around the mounting rings. CONSTITUTION:A round hole 2 and a step sections 3 are formed at the central section of a substrate 1 and probe mounting rings 4 are attached to the step sections 3 and probes 5 are supported on the mounting rings 4. As to the shape of the probes, the stem sections have equal thickness and taper sections are composed from the stem sections to the bending point and become narrower from the stem to the tip and the tip section is bent in hook shape. A plurality of probes are mounted in multilayer in the axial direction of the mounting rings. The end section of the probe tip mounted at the inner layer is longer than that mounted at the external layer and the probes mounted at the inner layer contact with electrodes provided at the central section of a chip and those mounted at the external layer contact with electrodes provided at the peripheral section of the chip.
JP55091356A 1980-05-27 1980-07-03 Semiconductor wafer testing probe Expired JPS5834935B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP55091356A JPS5834935B2 (en) 1980-07-03 1980-07-03 Semiconductor wafer testing probe
US06/266,054 US4523144A (en) 1980-05-27 1981-05-21 Complex probe card for testing a semiconductor wafer
US06/613,346 US4567433A (en) 1980-05-27 1984-05-23 Complex probe card for testing a semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55091356A JPS5834935B2 (en) 1980-07-03 1980-07-03 Semiconductor wafer testing probe

Publications (2)

Publication Number Publication Date
JPS5717143A true JPS5717143A (en) 1982-01-28
JPS5834935B2 JPS5834935B2 (en) 1983-07-29

Family

ID=14024100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55091356A Expired JPS5834935B2 (en) 1980-05-27 1980-07-03 Semiconductor wafer testing probe

Country Status (1)

Country Link
JP (1) JPS5834935B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605900U (en) * 1983-06-22 1985-01-16 畑佐　正巳 Freely transferable floor wall
JPH048973U (en) * 1990-05-14 1992-01-27
JPH10123175A (en) * 1996-10-24 1998-05-15 Micronics Japan Co Ltd Inspection head
KR101016387B1 (en) 2008-08-11 2011-02-21 티에스씨멤시스(주) Probe structures

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138224A (en) * 1974-09-30 1976-03-30 Hitachi Metals Ltd Fe cr co keijishakugokinnoseizohoho
JPS5353265A (en) * 1976-10-26 1978-05-15 Citizen Watch Co Ltd Prober

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5138224A (en) * 1974-09-30 1976-03-30 Hitachi Metals Ltd Fe cr co keijishakugokinnoseizohoho
JPS5353265A (en) * 1976-10-26 1978-05-15 Citizen Watch Co Ltd Prober

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605900U (en) * 1983-06-22 1985-01-16 畑佐　正巳 Freely transferable floor wall
JPH048973U (en) * 1990-05-14 1992-01-27
JPH10123175A (en) * 1996-10-24 1998-05-15 Micronics Japan Co Ltd Inspection head
KR101016387B1 (en) 2008-08-11 2011-02-21 티에스씨멤시스(주) Probe structures

Also Published As

Publication number Publication date
JPS5834935B2 (en) 1983-07-29

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