JPS57178341A - Wafer sucking device - Google Patents

Wafer sucking device

Info

Publication number
JPS57178341A
JPS57178341A JP56062499A JP6249981A JPS57178341A JP S57178341 A JPS57178341 A JP S57178341A JP 56062499 A JP56062499 A JP 56062499A JP 6249981 A JP6249981 A JP 6249981A JP S57178341 A JPS57178341 A JP S57178341A
Authority
JP
Japan
Prior art keywords
sucking
vacuum
wafer
outside
lag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56062499A
Other languages
Japanese (ja)
Inventor
Yorio Moriguchi
Koichiro Mizukami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56062499A priority Critical patent/JPS57178341A/en
Publication of JPS57178341A publication Critical patent/JPS57178341A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Abstract

PURPOSE:To improve the stickiness and flatness of a wafer, by dividing a vacuum sucking system into a plurality from the center of a wafer sucking plate to the outside, and by vacuum-sucking sequently at a designated lag time from the center of the vacuum sucking system to the outside. CONSTITUTION:A plurality of vacuum sucking holes 12 are provided on a wafer sucking plate 10 of a wafer sucking device to vacuum-suck a wafer 14 on the sucking plate 10. A vacuum sucking system for applying vacuum sucking forces to the sucking holes 12 is divided into three systems. Namely, it is divided into a central vacuum sucking system 16, an intermediate vacuum sucking system 18 located in the middle, and an outside vacuum sucking system 20 located far outside. The sucking systems 16, 18 and 20 are constituted to have a designated lag in vacuum sucking time mutually. They are combined with a vacuum source through a change-over valve mechanism. Namely, the sucking system 16 first starts vacuum-sucking, then, the sucking system 18 does in a designated time lag, and the sucking system 20 last does in another designated time lag. As a result, no dificient stick occurs at the center, as cimpared to the case of sucking a wafer at the same time.
JP56062499A 1981-04-27 1981-04-27 Wafer sucking device Pending JPS57178341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56062499A JPS57178341A (en) 1981-04-27 1981-04-27 Wafer sucking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56062499A JPS57178341A (en) 1981-04-27 1981-04-27 Wafer sucking device

Publications (1)

Publication Number Publication Date
JPS57178341A true JPS57178341A (en) 1982-11-02

Family

ID=13201913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56062499A Pending JPS57178341A (en) 1981-04-27 1981-04-27 Wafer sucking device

Country Status (1)

Country Link
JP (1) JPS57178341A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6385331A (en) * 1986-09-29 1988-04-15 Shimadzu Corp Vacuum suction device
JPH0463142U (en) * 1990-10-02 1992-05-29
JPH11150176A (en) * 1997-11-18 1999-06-02 Tokyo Electron Ltd Substrate holding method, substrate holding device, and substrate processing method
JP2018030199A (en) * 2016-08-24 2018-03-01 富士通株式会社 Robot hand, robot apparatus, and member peeling method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6385331A (en) * 1986-09-29 1988-04-15 Shimadzu Corp Vacuum suction device
JPH0463142U (en) * 1990-10-02 1992-05-29
JPH11150176A (en) * 1997-11-18 1999-06-02 Tokyo Electron Ltd Substrate holding method, substrate holding device, and substrate processing method
JP2018030199A (en) * 2016-08-24 2018-03-01 富士通株式会社 Robot hand, robot apparatus, and member peeling method

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