JPS57178450U - - Google Patents
Info
- Publication number
- JPS57178450U JPS57178450U JP1981067209U JP6720981U JPS57178450U JP S57178450 U JPS57178450 U JP S57178450U JP 1981067209 U JP1981067209 U JP 1981067209U JP 6720981 U JP6720981 U JP 6720981U JP S57178450 U JPS57178450 U JP S57178450U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981067209U JPS57178450U (2) | 1981-05-08 | 1981-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981067209U JPS57178450U (2) | 1981-05-08 | 1981-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57178450U true JPS57178450U (2) | 1982-11-11 |
Family
ID=29863221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981067209U Pending JPS57178450U (2) | 1981-05-08 | 1981-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57178450U (2) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018040816A (ja) * | 2017-12-14 | 2018-03-15 | 株式会社東芝 | センサ |
| JP2021111700A (ja) * | 2020-01-10 | 2021-08-02 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
-
1981
- 1981-05-08 JP JP1981067209U patent/JPS57178450U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018040816A (ja) * | 2017-12-14 | 2018-03-15 | 株式会社東芝 | センサ |
| JP2021111700A (ja) * | 2020-01-10 | 2021-08-02 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |