JPS57190064A - Adhesive tape - Google Patents

Adhesive tape

Info

Publication number
JPS57190064A
JPS57190064A JP7424681A JP7424681A JPS57190064A JP S57190064 A JPS57190064 A JP S57190064A JP 7424681 A JP7424681 A JP 7424681A JP 7424681 A JP7424681 A JP 7424681A JP S57190064 A JPS57190064 A JP S57190064A
Authority
JP
Japan
Prior art keywords
adhesive tape
roughened surface
adhesive
drawn film
becomes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7424681A
Other languages
Japanese (ja)
Other versions
JPH0125355B2 (en
Inventor
Seiji Murakami
Kikuji Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP7424681A priority Critical patent/JPS57190064A/en
Publication of JPS57190064A publication Critical patent/JPS57190064A/en
Publication of JPH0125355B2 publication Critical patent/JPH0125355B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)

Abstract

PURPOSE: An adhesive tape that is made by coating a polypropylene drawn film having a specifically roughened surface with an adhesive on the roughened surface, thus showing good cutting properties, especially when a cutter is used.
CONSTITUTION: The surface of a propylene drawn film, for example, a drawn film of crystalline polypropylene or laminated film with the same used as the base material, is subjected to sand blast so that the mean roughness at the counter line Ra becomes 0.1W2.0μ and the mean roughness at 10 points Rz becomes 1.0W18.0 microns, preferably Ra is 0.2W1.2μ and Rz is 2.0W1.2μ. Further, the roughened surface is coated with an adhesive to give the objective adhesive tape.
COPYRIGHT: (C)1982,JPO&Japio
JP7424681A 1981-05-19 1981-05-19 Adhesive tape Granted JPS57190064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7424681A JPS57190064A (en) 1981-05-19 1981-05-19 Adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7424681A JPS57190064A (en) 1981-05-19 1981-05-19 Adhesive tape

Publications (2)

Publication Number Publication Date
JPS57190064A true JPS57190064A (en) 1982-11-22
JPH0125355B2 JPH0125355B2 (en) 1989-05-17

Family

ID=13541606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7424681A Granted JPS57190064A (en) 1981-05-19 1981-05-19 Adhesive tape

Country Status (1)

Country Link
JP (1) JPS57190064A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168142U (en) * 1985-04-08 1986-10-18
JPH0347885A (en) * 1988-12-16 1991-02-28 Koyo Kagaku Kk Adhesive tape
EP0967241A4 (en) * 1997-02-24 2000-04-05 Chisso Corp POLYPROPYLENE FILM WITH UNIAXIAL DRAWING
JP2002338911A (en) * 2001-05-21 2002-11-27 Nitto Denko Corp Protective sheet for semiconductor wafer processing
JP2004010552A (en) * 2002-06-07 2004-01-15 Hisamitsu Pharmaceut Co Inc Cataplasm
JP2008063474A (en) * 2006-09-08 2008-03-21 Okura Ind Co Ltd Base film for surface protection film
JP2009164596A (en) * 2007-12-12 2009-07-23 Hitachi Chem Co Ltd Adhesive film for circuit connection and method for recognizing mark for position identification of circuit member
KR101116536B1 (en) 2003-10-24 2012-03-13 닛토덴코 가부시키가이샤 An adhesive sheet for dicing, a dicing method, and a method for manufacturing a semiconductor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109233659A (en) * 2018-09-06 2019-01-18 陈裕旺 A kind of PO plane materiel UV adhesive tape and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5098939A (en) * 1973-12-29 1975-08-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5098939A (en) * 1973-12-29 1975-08-06

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168142U (en) * 1985-04-08 1986-10-18
JPH0347885A (en) * 1988-12-16 1991-02-28 Koyo Kagaku Kk Adhesive tape
EP0967241A4 (en) * 1997-02-24 2000-04-05 Chisso Corp POLYPROPYLENE FILM WITH UNIAXIAL DRAWING
US6670027B1 (en) 1997-02-24 2003-12-30 Chisso Corporation Uniaxially oriented polypropylene-based film
JP2002338911A (en) * 2001-05-21 2002-11-27 Nitto Denko Corp Protective sheet for semiconductor wafer processing
JP2004010552A (en) * 2002-06-07 2004-01-15 Hisamitsu Pharmaceut Co Inc Cataplasm
KR101116536B1 (en) 2003-10-24 2012-03-13 닛토덴코 가부시키가이샤 An adhesive sheet for dicing, a dicing method, and a method for manufacturing a semiconductor
JP2008063474A (en) * 2006-09-08 2008-03-21 Okura Ind Co Ltd Base film for surface protection film
JP2009164596A (en) * 2007-12-12 2009-07-23 Hitachi Chem Co Ltd Adhesive film for circuit connection and method for recognizing mark for position identification of circuit member

Also Published As

Publication number Publication date
JPH0125355B2 (en) 1989-05-17

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