JPS571902A - Method and apparatus for measuring wafer thickness for wafer lapping machine - Google Patents

Method and apparatus for measuring wafer thickness for wafer lapping machine

Info

Publication number
JPS571902A
JPS571902A JP7554580A JP7554580A JPS571902A JP S571902 A JPS571902 A JP S571902A JP 7554580 A JP7554580 A JP 7554580A JP 7554580 A JP7554580 A JP 7554580A JP S571902 A JPS571902 A JP S571902A
Authority
JP
Japan
Prior art keywords
wafer
surface plate
lapping
carrier
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7554580A
Other languages
English (en)
Inventor
Takashi Shimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7554580A priority Critical patent/JPS571902A/ja
Publication of JPS571902A publication Critical patent/JPS571902A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP7554580A 1980-06-06 1980-06-06 Method and apparatus for measuring wafer thickness for wafer lapping machine Pending JPS571902A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7554580A JPS571902A (en) 1980-06-06 1980-06-06 Method and apparatus for measuring wafer thickness for wafer lapping machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7554580A JPS571902A (en) 1980-06-06 1980-06-06 Method and apparatus for measuring wafer thickness for wafer lapping machine

Publications (1)

Publication Number Publication Date
JPS571902A true JPS571902A (en) 1982-01-07

Family

ID=13579272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7554580A Pending JPS571902A (en) 1980-06-06 1980-06-06 Method and apparatus for measuring wafer thickness for wafer lapping machine

Country Status (1)

Country Link
JP (1) JPS571902A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02257628A (ja) * 1989-03-30 1990-10-18 Kyushu Electron Metal Co Ltd 半導体基板の研磨方法及びその装置
US6168499B1 (en) 1998-05-26 2001-01-02 Samsung Electronics Co., Ltd. Grinding apparatus for semiconductor wafers
JP2013184277A (ja) * 2012-03-09 2013-09-19 Disco Corp バイト切削装置
CN113932682A (zh) * 2021-09-06 2022-01-14 苏州东大工程咨询管理有限公司 道路工程监理用混凝土层厚度检测装置及其实施方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239889A (en) * 1975-09-23 1977-03-28 Tousei Eng Service:Kk Method for measuring dimensions of lapping

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239889A (en) * 1975-09-23 1977-03-28 Tousei Eng Service:Kk Method for measuring dimensions of lapping

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02257628A (ja) * 1989-03-30 1990-10-18 Kyushu Electron Metal Co Ltd 半導体基板の研磨方法及びその装置
US6168499B1 (en) 1998-05-26 2001-01-02 Samsung Electronics Co., Ltd. Grinding apparatus for semiconductor wafers
JP2013184277A (ja) * 2012-03-09 2013-09-19 Disco Corp バイト切削装置
CN113932682A (zh) * 2021-09-06 2022-01-14 苏州东大工程咨询管理有限公司 道路工程监理用混凝土层厚度检测装置及其实施方法

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