JPS57194545A - Attracting plate for wafer - Google Patents

Attracting plate for wafer

Info

Publication number
JPS57194545A
JPS57194545A JP56079193A JP7919381A JPS57194545A JP S57194545 A JPS57194545 A JP S57194545A JP 56079193 A JP56079193 A JP 56079193A JP 7919381 A JP7919381 A JP 7919381A JP S57194545 A JPS57194545 A JP S57194545A
Authority
JP
Japan
Prior art keywords
wafer
foreign substance
wafer attracting
low friction
attracting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56079193A
Other languages
Japanese (ja)
Inventor
Yasushi Hoshi
Hiroshi Nishizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP56079193A priority Critical patent/JPS57194545A/en
Publication of JPS57194545A publication Critical patent/JPS57194545A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Weting (AREA)

Abstract

PURPOSE:To prevent the adhesion of foreign substance as well as to prevent the running of resist by a method wherein a foreign substance preventing layer of low friction material is coated on the part, contacting the wafer, of the wafer attracting part on the wafer attracting plate. CONSTITUTION:The foreign substance preventing layer of low friction material, consisting of fluous resin and the like, is coated on the point of the wafer attracting part 14 on the wafer attracting plate, consisting of a wafer attracting part 14 with a wafer attracting hole 16 and an arm part 12. As a result, the adhesion of the foreign substance is reduced, and the exfoliation of the resist can also be prevented because of low friction.
JP56079193A 1981-05-27 1981-05-27 Attracting plate for wafer Pending JPS57194545A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56079193A JPS57194545A (en) 1981-05-27 1981-05-27 Attracting plate for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56079193A JPS57194545A (en) 1981-05-27 1981-05-27 Attracting plate for wafer

Publications (1)

Publication Number Publication Date
JPS57194545A true JPS57194545A (en) 1982-11-30

Family

ID=13683133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56079193A Pending JPS57194545A (en) 1981-05-27 1981-05-27 Attracting plate for wafer

Country Status (1)

Country Link
JP (1) JPS57194545A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377344U (en) * 1986-11-10 1988-05-23

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434773A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Vacuum tweezers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434773A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Vacuum tweezers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377344U (en) * 1986-11-10 1988-05-23

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