JPS57197828A - Precoating resin application on semiconductor device - Google Patents

Precoating resin application on semiconductor device

Info

Publication number
JPS57197828A
JPS57197828A JP56082773A JP8277381A JPS57197828A JP S57197828 A JPS57197828 A JP S57197828A JP 56082773 A JP56082773 A JP 56082773A JP 8277381 A JP8277381 A JP 8277381A JP S57197828 A JPS57197828 A JP S57197828A
Authority
JP
Japan
Prior art keywords
pellet
fringe
coating resin
coating
solidified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56082773A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6150380B2 (fr
Inventor
Kazunori Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56082773A priority Critical patent/JPS57197828A/ja
Publication of JPS57197828A publication Critical patent/JPS57197828A/ja
Publication of JPS6150380B2 publication Critical patent/JPS6150380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP56082773A 1981-05-29 1981-05-29 Precoating resin application on semiconductor device Granted JPS57197828A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56082773A JPS57197828A (en) 1981-05-29 1981-05-29 Precoating resin application on semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56082773A JPS57197828A (en) 1981-05-29 1981-05-29 Precoating resin application on semiconductor device

Publications (2)

Publication Number Publication Date
JPS57197828A true JPS57197828A (en) 1982-12-04
JPS6150380B2 JPS6150380B2 (fr) 1986-11-04

Family

ID=13783747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56082773A Granted JPS57197828A (en) 1981-05-29 1981-05-29 Precoating resin application on semiconductor device

Country Status (1)

Country Link
JP (1) JPS57197828A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61158066A (ja) * 1984-12-28 1986-07-17 Pioneer Electronic Corp 記録情報再生装置

Also Published As

Publication number Publication date
JPS6150380B2 (fr) 1986-11-04

Similar Documents

Publication Publication Date Title
JPS5762539A (en) Mounting method for semiconductor element
IE831279L (en) Resin-sealed semiconductor devices
JPS57197828A (en) Precoating resin application on semiconductor device
JPS57166051A (en) Semiconductor device
JPS556867A (en) Vessel for semiconductor device
JPS57115850A (en) Chip carrier for semiconductor ic
CN217883993U (zh) 一种线路板元器件包胶治具
JPS5824446Y2 (ja) 半導体装置
JPS5636145A (en) Thin semiconductor integrated circuit device and its manufacture
JPS54129880A (en) Manufacture for semiconductor device
JPS57148362A (en) Semiconductor device
JPS59224147A (ja) 半導体装置
JPH0237752A (ja) 半導体装置
JPS56158462A (en) Lead frame for single inline semiconductor device
JPS55148445A (en) Semiconductor device
JPS55160450A (en) Lead frame for semiconductor device
JPS641262A (en) Electronic device and manufacture thereof
JPS57192057A (en) Semiconductor device
JPS5910753Y2 (ja) 半導体装置
JPS57170542A (en) Semiconductor device
JPS642328A (en) Manufacture of resin-sealed semiconductor device
JPS5662348A (en) Semiconductor device and production thereof
JPS63310147A (ja) 半導体装置の製造方法
JPS647547A (en) Resin-sealed semiconductor device
JPS61253840A (ja) 半導体装置