JPS5721848A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5721848A
JPS5721848A JP9720480A JP9720480A JPS5721848A JP S5721848 A JPS5721848 A JP S5721848A JP 9720480 A JP9720480 A JP 9720480A JP 9720480 A JP9720480 A JP 9720480A JP S5721848 A JPS5721848 A JP S5721848A
Authority
JP
Japan
Prior art keywords
terminals
bent
board
semiconductor device
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9720480A
Other languages
Japanese (ja)
Inventor
Katsuyoshi Hirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9720480A priority Critical patent/JPS5721848A/en
Publication of JPS5721848A publication Critical patent/JPS5721848A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a semiconductor device capable of being readily and effectively mounted on a printed circuit board by using both a terminal for perpendicularly picking up and a terminal bent in an L-shaped on the side face of a package. CONSTITUTION:Terminals 12a picked up rectilinearly in a perpendicular direction with respect to the side face of a package 11 and bent terminals 12b of the shape bent in an L shape are alternately arranged. When multiterminal elements 11 are mounted on a printed circuit board, the bent terminals 12b are inserted into the holes 13s of the board, are soldered to the pattern on the back surface, and the terminals 12a are soldered to the pattern on the surface of the board. Thus, it can facilitate positioning and inserting of the terminals.
JP9720480A 1980-07-16 1980-07-16 Semiconductor device Pending JPS5721848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9720480A JPS5721848A (en) 1980-07-16 1980-07-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9720480A JPS5721848A (en) 1980-07-16 1980-07-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5721848A true JPS5721848A (en) 1982-02-04

Family

ID=14186077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9720480A Pending JPS5721848A (en) 1980-07-16 1980-07-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5721848A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165394A (en) * 1982-03-26 1983-09-30 キヤノン株式会社 Mounting structure of electronic components
JPS59191743U (en) * 1983-06-06 1984-12-19 シャープ株式会社 IC package
JPS61140526U (en) * 1985-02-20 1986-08-30
JPH04105526U (en) * 1991-02-22 1992-09-10 日本電気株式会社 Cylindrical chip parts

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58165394A (en) * 1982-03-26 1983-09-30 キヤノン株式会社 Mounting structure of electronic components
JPS59191743U (en) * 1983-06-06 1984-12-19 シャープ株式会社 IC package
JPS61140526U (en) * 1985-02-20 1986-08-30
JPH04105526U (en) * 1991-02-22 1992-09-10 日本電気株式会社 Cylindrical chip parts

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