JPS5723056B2 - - Google Patents
Info
- Publication number
- JPS5723056B2 JPS5723056B2 JP3194877A JP3194877A JPS5723056B2 JP S5723056 B2 JPS5723056 B2 JP S5723056B2 JP 3194877 A JP3194877 A JP 3194877A JP 3194877 A JP3194877 A JP 3194877A JP S5723056 B2 JPS5723056 B2 JP S5723056B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3194877A JPS53117216A (en) | 1977-03-23 | 1977-03-23 | Roof structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3194877A JPS53117216A (en) | 1977-03-23 | 1977-03-23 | Roof structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53117216A JPS53117216A (en) | 1978-10-13 |
| JPS5723056B2 true JPS5723056B2 (en) | 1982-05-17 |
Family
ID=12345176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3194877A Granted JPS53117216A (en) | 1977-03-23 | 1977-03-23 | Roof structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53117216A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017192517A1 (en) | 2016-05-06 | 2017-11-09 | Alpha Assembly Solutions Inc. | High reliability lead-free solder alloy |
| WO2018181873A1 (en) | 2017-03-31 | 2018-10-04 | 千住金属工業株式会社 | Solder alloy, solder paste, and solder joint |
| KR102133347B1 (en) | 2019-03-27 | 2020-07-13 | 센주긴조쿠고교 가부시키가이샤 | Solder alloy, solder ball, solder preform, solder paste and solder joint |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5826156A (en) * | 1981-08-08 | 1983-02-16 | 株式会社サンシュウ | Roof tile |
-
1977
- 1977-03-23 JP JP3194877A patent/JPS53117216A/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017192517A1 (en) | 2016-05-06 | 2017-11-09 | Alpha Assembly Solutions Inc. | High reliability lead-free solder alloy |
| US10821557B2 (en) | 2016-05-06 | 2020-11-03 | Alpha Assembly Solutions Inc. | High reliability lead-free solder alloy |
| WO2018181873A1 (en) | 2017-03-31 | 2018-10-04 | 千住金属工業株式会社 | Solder alloy, solder paste, and solder joint |
| KR102133347B1 (en) | 2019-03-27 | 2020-07-13 | 센주긴조쿠고교 가부시키가이샤 | Solder alloy, solder ball, solder preform, solder paste and solder joint |
| EP3715039A1 (en) | 2019-03-27 | 2020-09-30 | Senju Metal Industry Co., Ltd | Solder alloy, solder ball, solder preform, solder paste and solder joint |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53117216A (en) | 1978-10-13 |