JPS5723090A - Electroplating method for horizontally laid loop-shaped wire material - Google Patents

Abstract

PURPOSE: To electroplate the titled wire material continuously, uniformly, efficiently and keeping good adhesion of plating, by dividing and disposing anode electrodes into plural blocks in a plating tank and by controlling each feeding amount of every block to electroplate the wire material.

CONSTITUTION: Among D.C. electric sources 35W49, variable resistances for controlling current 20W34, anode electrode plates 5W19, the horizontally laid loop wire rod 2 and anode feeding rollers 50, 51, each independent electric circuit is formed to control the feeding amount independently at each anode electrode of the electrodes 5W19. Considering that e.g. the electric resistance at a position of the material increases as the position is situated nearer the middle point of the plating tank, the feeding amount to each of the electrodes 5W19 is controlled so that the feeding amount to an electrode is increased gradually or stepwisely as the electrode is situated near to the middle point apart from the inlet and outlet of the plating tank. Thus, an optimum controlling pattern for providing a desired plating thickness is established, thereby enabling efficient electroplating. The process can provide a plated wire material having an uniform thickness of plating and a good color tone.

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