JPS5726449A - Attachment of pellet and device therefor - Google Patents

Attachment of pellet and device therefor

Info

Publication number
JPS5726449A
JPS5726449A JP9994580A JP9994580A JPS5726449A JP S5726449 A JPS5726449 A JP S5726449A JP 9994580 A JP9994580 A JP 9994580A JP 9994580 A JP9994580 A JP 9994580A JP S5726449 A JPS5726449 A JP S5726449A
Authority
JP
Japan
Prior art keywords
pellet
scrubbing
period
attachment
crack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9994580A
Other languages
Japanese (ja)
Other versions
JPS6328340B2 (en
Inventor
Tatsuo Sugimoto
Masakazu Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9994580A priority Critical patent/JPS5726449A/en
Publication of JPS5726449A publication Critical patent/JPS5726449A/en
Publication of JPS6328340B2 publication Critical patent/JPS6328340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To preferably adhere a pellet without crack of the pellet by synchronizing X-direction and Y-direction scrubbing operations with one another. CONSTITUTION:X-direction and Y-direction scrubbing operations are lagged by T=1/4 period, and are synchronized in both scrubbing operations at every 1/4 period. The period in which the time t is elapsed while the X-direction scrubbing amount (a) remains constant and exhibits waiting time. According to this configration the locus of the synthesized scrubbing operation approaches the ideal circular motion, the crack of the pellet can be eliminated, and the pellet can be preferably adhered.
JP9994580A 1980-07-23 1980-07-23 Attachment of pellet and device therefor Granted JPS5726449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9994580A JPS5726449A (en) 1980-07-23 1980-07-23 Attachment of pellet and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9994580A JPS5726449A (en) 1980-07-23 1980-07-23 Attachment of pellet and device therefor

Publications (2)

Publication Number Publication Date
JPS5726449A true JPS5726449A (en) 1982-02-12
JPS6328340B2 JPS6328340B2 (en) 1988-06-08

Family

ID=14260838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9994580A Granted JPS5726449A (en) 1980-07-23 1980-07-23 Attachment of pellet and device therefor

Country Status (1)

Country Link
JP (1) JPS5726449A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124944A (en) * 1983-12-12 1985-07-04 Marine Instr Co Ltd Die-bonding method
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54136178A (en) * 1978-04-13 1979-10-23 Toshiba Corp Chip mounting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54136178A (en) * 1978-04-13 1979-10-23 Toshiba Corp Chip mounting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124944A (en) * 1983-12-12 1985-07-04 Marine Instr Co Ltd Die-bonding method
US5089439A (en) * 1990-02-02 1992-02-18 Hughes Aircraft Company Process for attaching large area silicon-backed chips to gold-coated surfaces

Also Published As

Publication number Publication date
JPS6328340B2 (en) 1988-06-08

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