JPS5739364A - Thermal resistance measuring method of semiconductor device - Google Patents

Thermal resistance measuring method of semiconductor device

Info

Publication number
JPS5739364A
JPS5739364A JP11497280A JP11497280A JPS5739364A JP S5739364 A JPS5739364 A JP S5739364A JP 11497280 A JP11497280 A JP 11497280A JP 11497280 A JP11497280 A JP 11497280A JP S5739364 A JPS5739364 A JP S5739364A
Authority
JP
Japan
Prior art keywords
thermal resistance
chip
heat
lamp
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11497280A
Other languages
Japanese (ja)
Inventor
Kazutoshi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11497280A priority Critical patent/JPS5739364A/en
Publication of JPS5739364A publication Critical patent/JPS5739364A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

PURPOSE:To exactly discriminate the variance of thermal resistance in a short time, by applying a great deal of heat to a semiconductor from the outside, and measuring a temperature in the inside of a chip. CONSTITUTION:A radiation fin 4 is heated by an infrared lamp from the outside. After the lamp has been lighted, a temperature of a chip is measured by utilizing P-N junction in a chip 2 after some time has elapsed. Heat which has been applied by the lamp 6 is transmitted through a path as R3 C3 R2 R1 C1, being scarcely influenced by a capacitor C4 of an equivalent circuit of a thermal flow. Accordingly, the higher a temperature of the chip rises after (t) time, the lower the thermal resistance is. When the quantity of heat from the lamp is increased, the quantity of heat passing through the thermal resistance Ri (i=1-3) is increased, a temperature difference is increased even if a difference of the thermal resistance is small, and the detecting sensitivity becomes high. Also, heat passes through almost all radiation routes which become important when they are used actually, and attains to the chip 2, therefore, the decision is executed very exactly.
JP11497280A 1980-08-20 1980-08-20 Thermal resistance measuring method of semiconductor device Pending JPS5739364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11497280A JPS5739364A (en) 1980-08-20 1980-08-20 Thermal resistance measuring method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11497280A JPS5739364A (en) 1980-08-20 1980-08-20 Thermal resistance measuring method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5739364A true JPS5739364A (en) 1982-03-04

Family

ID=14651178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11497280A Pending JPS5739364A (en) 1980-08-20 1980-08-20 Thermal resistance measuring method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5739364A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5960574U (en) * 1982-10-15 1984-04-20 日本電気ホームエレクトロニクス株式会社 Thermal resistance measuring device
WO1992010742A1 (en) * 1990-12-14 1992-06-25 Anritsu Corporation Sensing system for measuring characteristic value of member to be measured by utilizing changes in thermal resistance
US8350263B2 (en) 2009-11-02 2013-01-08 Shinko Electric Industries Co., Ltd. Semiconductor package, method of evaluating same, and method of manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5960574U (en) * 1982-10-15 1984-04-20 日本電気ホームエレクトロニクス株式会社 Thermal resistance measuring device
WO1992010742A1 (en) * 1990-12-14 1992-06-25 Anritsu Corporation Sensing system for measuring characteristic value of member to be measured by utilizing changes in thermal resistance
US5251980A (en) * 1990-12-14 1993-10-12 Anritsu Corporation Sensing system for measuring specific value of substance to be measured by utilizing change in thermal resistance
US8350263B2 (en) 2009-11-02 2013-01-08 Shinko Electric Industries Co., Ltd. Semiconductor package, method of evaluating same, and method of manufacturing same

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