JPS5740946A - Manufacturing equipment for semiconductor device - Google Patents

Manufacturing equipment for semiconductor device

Info

Publication number
JPS5740946A
JPS5740946A JP55117391A JP11739180A JPS5740946A JP S5740946 A JPS5740946 A JP S5740946A JP 55117391 A JP55117391 A JP 55117391A JP 11739180 A JP11739180 A JP 11739180A JP S5740946 A JPS5740946 A JP S5740946A
Authority
JP
Japan
Prior art keywords
bonding
tape
guide
semiconductor device
stable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55117391A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6117139B2 (2
Inventor
Tsutomu Taoka
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55117391A priority Critical patent/JPS5740946A/ja
Publication of JPS5740946A publication Critical patent/JPS5740946A/ja
Publication of JPS6117139B2 publication Critical patent/JPS6117139B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
JP55117391A 1980-08-26 1980-08-26 Manufacturing equipment for semiconductor device Granted JPS5740946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55117391A JPS5740946A (en) 1980-08-26 1980-08-26 Manufacturing equipment for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55117391A JPS5740946A (en) 1980-08-26 1980-08-26 Manufacturing equipment for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5740946A true JPS5740946A (en) 1982-03-06
JPS6117139B2 JPS6117139B2 (2) 1986-05-06

Family

ID=14710486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55117391A Granted JPS5740946A (en) 1980-08-26 1980-08-26 Manufacturing equipment for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5740946A (2)

Also Published As

Publication number Publication date
JPS6117139B2 (2) 1986-05-06

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