JPS5743820A - Manufacture of moldform panel - Google Patents
Manufacture of moldform panelInfo
- Publication number
- JPS5743820A JPS5743820A JP55073553A JP7355380A JPS5743820A JP S5743820 A JPS5743820 A JP S5743820A JP 55073553 A JP55073553 A JP 55073553A JP 7355380 A JP7355380 A JP 7355380A JP S5743820 A JPS5743820 A JP S5743820A
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- electrode
- surface material
- heater
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 9
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Ceramic Products (AREA)
Abstract
PURPOSE: To manufacture a moldform panel for a short time by applying a high frequency voltage to pressure a first material with a heat being generated from a heater of a first electrode plate after a first surface plate high in the dielectric characteristic of the material is arranged on the second electrode plate side adhering to a metal piece face.
CONSTITUTION: A first material 6 in which a first surface material 4a high in the dielectric characteristic is piled on one surface of a metal mold 2 through an unhardened adhesive layer 3b is arranged between a first high frequency electrode 5b embedded with a heater and a second high frequency electrode 5a with the surface material 4a on the electrode 5a to pressurize. A high frequency voltage is applied between the electrodes 5a and 5b and an adhesive layer 3b is solidified with a heat generated from the heater to adhere to the surface material 4a. Then, A second surface material 4b low in the dielectric characteristic is stacked on the mold 2 through the unhardened adhesive 3b to make a second material 7 to be pressurized, which is pressurized between the electrodes 5a and 5b while a high frequency voltage is applied to solidify the adhesive 3b whereby the surface material 4b adheres to the mold 2.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55073553A JPS5743820A (en) | 1980-05-30 | 1980-05-30 | Manufacture of moldform panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55073553A JPS5743820A (en) | 1980-05-30 | 1980-05-30 | Manufacture of moldform panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5743820A true JPS5743820A (en) | 1982-03-12 |
| JPS6357477B2 JPS6357477B2 (en) | 1988-11-11 |
Family
ID=13521540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55073553A Granted JPS5743820A (en) | 1980-05-30 | 1980-05-30 | Manufacture of moldform panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5743820A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102501281A (en) * | 2011-10-13 | 2012-06-20 | 青岛国森机械有限公司 | Hydraulic press for multi-layer bamboo wood integrated material |
-
1980
- 1980-05-30 JP JP55073553A patent/JPS5743820A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102501281A (en) * | 2011-10-13 | 2012-06-20 | 青岛国森机械有限公司 | Hydraulic press for multi-layer bamboo wood integrated material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6357477B2 (en) | 1988-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE8202768L (en) | METHOD FOR MAKING BATTERY NOZZLE CHANNELS AND INK RADIO PRINCIPLES INCLUDING A BOTTOM NOZZLE CHANNEL MADE ACCORDING TO THE METHOD | |
| JPS55142565A (en) | Coating method | |
| ES8703774A1 (en) | Method for the treatment of a protective film and its application to a plate. | |
| JPS5743820A (en) | Manufacture of moldform panel | |
| BE875392A (en) | THERMOINSULATING ELEMENT IN THE FORM OF A PLATE WITH AN INSULATING LAYER IN ALVEOLAR MATERIAL AND METHOD FOR MANUFACTURING THIS ELEMENT | |
| JPS54113253A (en) | Bonding method of semiconductor pellet | |
| JPS5670914A (en) | Device for manufacturing flush pannel by dielectric adhering method | |
| JPS57109928A (en) | Flash device | |
| JPS557474A (en) | Forming method for film resistor of thermal recording head | |
| JPS5466161A (en) | Forming method of display cell | |
| JPS57169356A (en) | Producing method for stencil printing plate | |
| JPS6451610A (en) | Formation of electrode on ceramic raw sheet | |
| JPS5261472A (en) | Fluorescent surface formation method of cathode-ray tube | |
| GB918483A (en) | Improvements in or relating to printed circuits | |
| JPS5524513A (en) | Multistage honeycomb structure | |
| JPS57100027A (en) | Manufacture of interior material | |
| JPS5692141A (en) | Production of laminated glass using self-adhesive film | |
| JPS5699272A (en) | Dielectric bonding method of panel | |
| JPS5753120A (en) | Production of adhesive substrate for precise lapping of thin material | |
| JPS55136124A (en) | Manufacture of zinc oxide film | |
| JPS57104245A (en) | Semiconductor device | |
| JPS5699271A (en) | Bonding method of fabricated panel by dielectric heating | |
| JPS5583164A (en) | Manufacturing method of sintering type electrode | |
| JPS57107086A (en) | Lamination of piezoelectric ceramic green sheet | |
| JPS5763912A (en) | Electrode forming method |