JPS5747579A - Solder dipping method - Google Patents

Solder dipping method

Info

Publication number
JPS5747579A
JPS5747579A JP12205180A JP12205180A JPS5747579A JP S5747579 A JPS5747579 A JP S5747579A JP 12205180 A JP12205180 A JP 12205180A JP 12205180 A JP12205180 A JP 12205180A JP S5747579 A JPS5747579 A JP S5747579A
Authority
JP
Japan
Prior art keywords
solder
parts
flux
reducing gas
high temp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12205180A
Other languages
Japanese (ja)
Inventor
Minoru Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12205180A priority Critical patent/JPS5747579A/en
Publication of JPS5747579A publication Critical patent/JPS5747579A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To realize uniform solder dipping without immersion into soldering vessels by supplying flux and solder then ejecting a high temp. reducing gas thereby melting the solder.
CONSTITUTION: While transistor lead soldering parts 2 are preheated in the atmosphere of the high temp. reducing gas 12 ejected from gas diffusion ports 11, presolder 9 and flux 10 are dropped at suitable rates respectively from a solder vessel 7 and a flux vessel 8 and are allowed to stick on the centers of the parts 2. Next, the high temp. reducing gas 12 of a temp. slightly higher than that at the preheating is ijected from the circumference of the parts 2 to spread the presolder 9 over the entire part of the parts 2, wherby so-called solder dipping is carried out. Thereby, the surface ruggedness by solder waste, solder drips, etc. is eliminated, and the neat solder dipping is made possible.
COPYRIGHT: (C)1982,JPO&Japio
JP12205180A 1980-09-02 1980-09-02 Solder dipping method Pending JPS5747579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12205180A JPS5747579A (en) 1980-09-02 1980-09-02 Solder dipping method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12205180A JPS5747579A (en) 1980-09-02 1980-09-02 Solder dipping method

Publications (1)

Publication Number Publication Date
JPS5747579A true JPS5747579A (en) 1982-03-18

Family

ID=14826389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12205180A Pending JPS5747579A (en) 1980-09-02 1980-09-02 Solder dipping method

Country Status (1)

Country Link
JP (1) JPS5747579A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994568A (en) * 1982-11-19 1984-05-31 エツセジ−エツセ−アテイイ−エツセ・コンポネンテイ・エレツトロニ−チ・ソチエタ・ペル・アノニマ Method of welding and fitting semiconductor chip onto non-precious metal substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994568A (en) * 1982-11-19 1984-05-31 エツセジ−エツセ−アテイイ−エツセ・コンポネンテイ・エレツトロニ−チ・ソチエタ・ペル・アノニマ Method of welding and fitting semiconductor chip onto non-precious metal substrate

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