JPS5750067B2 - - Google Patents
Info
- Publication number
- JPS5750067B2 JPS5750067B2 JP55169611A JP16961180A JPS5750067B2 JP S5750067 B2 JPS5750067 B2 JP S5750067B2 JP 55169611 A JP55169611 A JP 55169611A JP 16961180 A JP16961180 A JP 16961180A JP S5750067 B2 JPS5750067 B2 JP S5750067B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16961180A JPS56107566A (en) | 1980-12-03 | 1980-12-03 | Resin sealing method for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16961180A JPS56107566A (en) | 1980-12-03 | 1980-12-03 | Resin sealing method for semiconductor device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49102085A Division JPS5748858B2 (da) | 1974-09-06 | 1974-09-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56107566A JPS56107566A (en) | 1981-08-26 |
| JPS5750067B2 true JPS5750067B2 (da) | 1982-10-25 |
Family
ID=15889699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16961180A Granted JPS56107566A (en) | 1980-12-03 | 1980-12-03 | Resin sealing method for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56107566A (da) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03104873U (da) * | 1990-02-07 | 1991-10-30 | ||
| JPH03257377A (ja) * | 1990-03-07 | 1991-11-15 | Tokyo Electric Power Co Inc:The | 電気接続装置 |
| KR20210020996A (ko) * | 2018-06-13 | 2021-02-24 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Lgps계 고체 전해질 및 제조 방법 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2328798A1 (de) * | 1972-06-23 | 1974-01-17 | Philips Nv | Halbleiteranordnung |
-
1980
- 1980-12-03 JP JP16961180A patent/JPS56107566A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03104873U (da) * | 1990-02-07 | 1991-10-30 | ||
| JPH03257377A (ja) * | 1990-03-07 | 1991-11-15 | Tokyo Electric Power Co Inc:The | 電気接続装置 |
| KR20210020996A (ko) * | 2018-06-13 | 2021-02-24 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Lgps계 고체 전해질 및 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56107566A (en) | 1981-08-26 |