JPS5751937B2 - - Google Patents
Info
- Publication number
- JPS5751937B2 JPS5751937B2 JP52021105A JP2110577A JPS5751937B2 JP S5751937 B2 JPS5751937 B2 JP S5751937B2 JP 52021105 A JP52021105 A JP 52021105A JP 2110577 A JP2110577 A JP 2110577A JP S5751937 B2 JPS5751937 B2 JP S5751937B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2110577A JPS53105972A (en) | 1977-02-28 | 1977-02-28 | Method of presssbonding tape bonder without solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2110577A JPS53105972A (en) | 1977-02-28 | 1977-02-28 | Method of presssbonding tape bonder without solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53105972A JPS53105972A (en) | 1978-09-14 |
| JPS5751937B2 true JPS5751937B2 (mo) | 1982-11-05 |
Family
ID=12045584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2110577A Granted JPS53105972A (en) | 1977-02-28 | 1977-02-28 | Method of presssbonding tape bonder without solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53105972A (mo) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0455028U (mo) * | 1990-09-17 | 1992-05-12 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0388344A (ja) * | 1989-08-31 | 1991-04-12 | Seiko Epson Corp | インナーリードのボンディング方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4010885A (en) * | 1974-09-30 | 1977-03-08 | The Jade Corporation | Apparatus for accurately bonding leads to a semi-conductor die or the like |
-
1977
- 1977-02-28 JP JP2110577A patent/JPS53105972A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0455028U (mo) * | 1990-09-17 | 1992-05-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53105972A (en) | 1978-09-14 |