JPS5752143A - Mounting method and device for semiconductor pellet - Google Patents

Mounting method and device for semiconductor pellet

Info

Publication number
JPS5752143A
JPS5752143A JP12717780A JP12717780A JPS5752143A JP S5752143 A JPS5752143 A JP S5752143A JP 12717780 A JP12717780 A JP 12717780A JP 12717780 A JP12717780 A JP 12717780A JP S5752143 A JPS5752143 A JP S5752143A
Authority
JP
Japan
Prior art keywords
pellet
pellets
substrate
divided
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12717780A
Other languages
English (en)
Inventor
Osamu Ichikawa
Tetsuo Sadamasa
Tatsuro Beppu
Kyozo Ide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12717780A priority Critical patent/JPS5752143A/ja
Publication of JPS5752143A publication Critical patent/JPS5752143A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H10W72/07207—Temporary substrates, e.g. removable substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07302—Connecting or disconnecting of die-attach connectors using an auxiliary member
    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP12717780A 1980-09-16 1980-09-16 Mounting method and device for semiconductor pellet Pending JPS5752143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12717780A JPS5752143A (en) 1980-09-16 1980-09-16 Mounting method and device for semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12717780A JPS5752143A (en) 1980-09-16 1980-09-16 Mounting method and device for semiconductor pellet

Publications (1)

Publication Number Publication Date
JPS5752143A true JPS5752143A (en) 1982-03-27

Family

ID=14953568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12717780A Pending JPS5752143A (en) 1980-09-16 1980-09-16 Mounting method and device for semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS5752143A (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169460A (ja) * 1982-03-30 1983-10-05 アイシン精機株式会社 人工心臓駆動装置
JPH04152682A (ja) * 1990-10-17 1992-05-26 Nec Corp アレイ状光素子用サブ基板の作製方法
US5393706A (en) * 1993-01-07 1995-02-28 Texas Instruments Incorporated Integrated partial sawing process
JP2002118124A (ja) * 2000-10-06 2002-04-19 Sony Corp 素子実装方法
JP2002231877A (ja) * 2001-02-06 2002-08-16 Sony Corp 素子配列型装置、素子配列型装置の製造方法、及び画像表示装置
FR2877142A1 (fr) * 2004-10-21 2006-04-28 Commissariat Energie Atomique Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere.
JP2006173190A (ja) * 2004-12-13 2006-06-29 Hitachi Chem Co Ltd 半導体装置の製造方法及びｉｃチップ配列用支持材
JP2007281264A (ja) * 2006-04-10 2007-10-25 Elpida Memory Inc 半導体装置の製造方法
JP2008010841A (ja) * 2006-05-31 2008-01-17 Semiconductor Energy Lab Co Ltd 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置
JP2016042580A (ja) * 2007-01-17 2016-03-31 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 印刷ベースの組立により製作される光学システム
CN108470698A (zh) * 2018-03-27 2018-08-31 唐人制造（宁波）有限公司 一种工件对准贴装装置及其方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169460A (ja) * 1982-03-30 1983-10-05 アイシン精機株式会社 人工心臓駆動装置
JPH04152682A (ja) * 1990-10-17 1992-05-26 Nec Corp アレイ状光素子用サブ基板の作製方法
US5393706A (en) * 1993-01-07 1995-02-28 Texas Instruments Incorporated Integrated partial sawing process
US5527744A (en) * 1993-01-07 1996-06-18 Texas Instruments Incorporated Wafer method for breaking a semiconductor
JP2002118124A (ja) * 2000-10-06 2002-04-19 Sony Corp 素子実装方法
JP2002231877A (ja) * 2001-02-06 2002-08-16 Sony Corp 素子配列型装置、素子配列型装置の製造方法、及び画像表示装置
FR2877142A1 (fr) * 2004-10-21 2006-04-28 Commissariat Energie Atomique Procede de transfert d'au moins un objet de taille micrometrique ou millimetrique au moyen d'une poignee en polymere.
JP2006173190A (ja) * 2004-12-13 2006-06-29 Hitachi Chem Co Ltd 半導体装置の製造方法及びｉｃチップ配列用支持材
JP2007281264A (ja) * 2006-04-10 2007-10-25 Elpida Memory Inc 半導体装置の製造方法
JP2008010841A (ja) * 2006-05-31 2008-01-17 Semiconductor Energy Lab Co Ltd 貼りあわせ方法、貼りあわせ装置、半導体装置の作製方法及び半導体装置の製造装置
JP2016042580A (ja) * 2007-01-17 2016-03-31 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 印刷ベースの組立により製作される光学システム
US10361180B2 (en) 2007-01-17 2019-07-23 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US10424572B2 (en) 2007-01-17 2019-09-24 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US10504882B2 (en) 2007-01-17 2019-12-10 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US11309305B2 (en) 2007-01-17 2022-04-19 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US12136620B2 (en) 2007-01-17 2024-11-05 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
CN108470698A (zh) * 2018-03-27 2018-08-31 唐人制造（宁波）有限公司 一种工件对准贴装装置及其方法
CN108470698B (zh) * 2018-03-27 2021-06-11 唐人制造（宁波）有限公司 一种工件对准贴装装置及其方法

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