JPS575350A - Mounting device for power semiconductor device - Google Patents

Mounting device for power semiconductor device

Info

Publication number
JPS575350A
JPS575350A JP8037580A JP8037580A JPS575350A JP S575350 A JPS575350 A JP S575350A JP 8037580 A JP8037580 A JP 8037580A JP 8037580 A JP8037580 A JP 8037580A JP S575350 A JPS575350 A JP S575350A
Authority
JP
Japan
Prior art keywords
wall
plate
semiconductor device
power semiconductor
bracket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8037580A
Other languages
Japanese (ja)
Inventor
Toshio Imanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8037580A priority Critical patent/JPS575350A/en
Publication of JPS575350A publication Critical patent/JPS575350A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Abstract

PURPOSE:To improve the heat dissipating effect of a power semiconductor device by securing the semiconductor device with a mounting bracket for pressing the device from its upper surface, thereby uniformly applying force to the discharging metallic plate. CONSTITUTION:A power semiconductor device 11, e.g., a power transistor or the like is secured with a mounting bracket 17. The bracket 17 is composed of a horizontal wall 18 extending along the upper surface of the device 11 and a leg wall 19 provided for mounting vertically on one end of the wall 18. The device 11 can be pressed and held to the plate 12 with the wall 18 by securing the lower end 19a of the wall 19 via locking screw 20 to the plate 12. Since the device 11 can be pressed to the plate 12 with the wall 18 of the bracket 17 in this manner, the semiconductor element 11 can be uniformly brought into planar contact with the plate 12 in all area. Consequently, the heat transfer effect can be enhanced without reducing the thickness of an electrically insulating plate 14.
JP8037580A 1980-06-12 1980-06-12 Mounting device for power semiconductor device Pending JPS575350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8037580A JPS575350A (en) 1980-06-12 1980-06-12 Mounting device for power semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8037580A JPS575350A (en) 1980-06-12 1980-06-12 Mounting device for power semiconductor device

Publications (1)

Publication Number Publication Date
JPS575350A true JPS575350A (en) 1982-01-12

Family

ID=13716525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8037580A Pending JPS575350A (en) 1980-06-12 1980-06-12 Mounting device for power semiconductor device

Country Status (1)

Country Link
JP (1) JPS575350A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992010000A1 (en) * 1990-11-24 1992-06-11 Robert Bosch Gmbh Power component with electrical insulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992010000A1 (en) * 1990-11-24 1992-06-11 Robert Bosch Gmbh Power component with electrical insulation

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