JPS5754352A - Vapor cooling device - Google Patents

Vapor cooling device

Info

Publication number
JPS5754352A
JPS5754352A JP55129297A JP12929780A JPS5754352A JP S5754352 A JPS5754352 A JP S5754352A JP 55129297 A JP55129297 A JP 55129297A JP 12929780 A JP12929780 A JP 12929780A JP S5754352 A JPS5754352 A JP S5754352A
Authority
JP
Japan
Prior art keywords
nuclei
cavities
boiling
chip
bubbles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55129297A
Other languages
Japanese (ja)
Inventor
Noriyuki Ashiwake
Hisashi Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55129297A priority Critical patent/JPS5754352A/en
Publication of JPS5754352A publication Critical patent/JPS5754352A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To generate stable boiling from the face of chip of a vapor cooling device by a method wherein cavities are formed by making a porous plate having plural fine holes to approach to the chip face, and the cavities thereof are used as nuclei of bubbles. CONSTITUTION:The chip substrate 7 and the porous copper plate 8 arranged at the back thereof are provided, the cavities 9 are formed at the inside of this porous plate 8 by plural ribs 8a, the plural fine holes 8b are bored at the positions corresponding to the cavities 9, and caves spreading out in a fan-shape are formed on the chip face by the cavities 9 and the holes 8b. Accordingly concavities and convexities formed by the ribs 8a act as the nuclei of bubbles to make boiling of nuclei to start, and when boiling of nuclei is made to start once, the caves spreading out in a fan- shape formed by the cavities 9 and the holes 8b act as the nuclei of bubbles extremely effectively, and promotes stable boiling of nuclei.
JP55129297A 1980-09-19 1980-09-19 Vapor cooling device Pending JPS5754352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55129297A JPS5754352A (en) 1980-09-19 1980-09-19 Vapor cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55129297A JPS5754352A (en) 1980-09-19 1980-09-19 Vapor cooling device

Publications (1)

Publication Number Publication Date
JPS5754352A true JPS5754352A (en) 1982-03-31

Family

ID=15006081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55129297A Pending JPS5754352A (en) 1980-09-19 1980-09-19 Vapor cooling device

Country Status (1)

Country Link
JP (1) JPS5754352A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2534362A1 (en) * 1982-10-08 1984-04-13 Otdel Fiz Teknnicheskikh Prob Heat transmission device
JPS59215797A (en) * 1983-03-24 1984-12-05 ユ−オ−ピ−・インコ−ポレ−テツド Intensified nuclear boiling surface tape and cooling of electronic part
FR2766967A1 (en) * 1997-07-31 1999-02-05 Scps THERMAL DISSIPATION AND / OR ELECTROMAGNETIC PROTECTION DEVICE FOR ELECTRONIC CARDS AND COMPONENTS
WO2002023115A3 (en) * 2000-09-15 2002-05-30 Mems Optical Inc Enhanced surface structures for passive immersion cooling of integrated circuits
JP2003103071A (en) * 2001-09-28 2003-04-08 Maruto Hasegawa Kosakusho:Kk Grasping scissors
KR100676315B1 (en) * 2000-03-15 2007-01-31 삼성전자주식회사 High Thermal Emission Semiconductor Chip Package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2534362A1 (en) * 1982-10-08 1984-04-13 Otdel Fiz Teknnicheskikh Prob Heat transmission device
JPS59215797A (en) * 1983-03-24 1984-12-05 ユ−オ−ピ−・インコ−ポレ−テツド Intensified nuclear boiling surface tape and cooling of electronic part
FR2766967A1 (en) * 1997-07-31 1999-02-05 Scps THERMAL DISSIPATION AND / OR ELECTROMAGNETIC PROTECTION DEVICE FOR ELECTRONIC CARDS AND COMPONENTS
KR100676315B1 (en) * 2000-03-15 2007-01-31 삼성전자주식회사 High Thermal Emission Semiconductor Chip Package
WO2002023115A3 (en) * 2000-09-15 2002-05-30 Mems Optical Inc Enhanced surface structures for passive immersion cooling of integrated circuits
JP2003103071A (en) * 2001-09-28 2003-04-08 Maruto Hasegawa Kosakusho:Kk Grasping scissors

Similar Documents

Publication Publication Date Title
JPS5754352A (en) Vapor cooling device
JPS5326689A (en) Semiconductor integrated circuit unit
JPS5275180A (en) Package for integrated circuits
JPS52132701A (en) Console containing electronic equipment
JPS51118391A (en) Manufacturing process for semiconducter unit
JPS5427368A (en) Manufacture of microwave circuit pattern
JPS5416963A (en) Differetiating circuit
JPS5424350A (en) Improvement of ice-making plate used in automatic ice-making machine
JPS5399553A (en) Heat radiating body
JPS5318966A (en) Production of semiconductor integrated circuit
JPS5391684A (en) Semiconductor laser
JPS5359957A (en) Ceramic heat transmission plate and method for producing same
JPS535587A (en) Piezoelectric oscillator
JPS527668A (en) Method of manufacturing microchannel plates
JPS533623A (en) Converter device
JPS52130584A (en) Distribution feedback type laser
JPS5232675A (en) Etching solution for chemical compound
JPS533770A (en) Manufacture of anode for magnetron
JPS53120333A (en) Parts arrangement method of printed circuit substrate
JPS5390745A (en) Oscillator circuit
JPS544030A (en) Control pattern for magnetic bubble element
JPS53142168A (en) Reproductive use of semiconductor substrate
JPS51134470A (en) A cartridge fi lter and a method for producing the same
JPS53113274A (en) Continuous ion exchange method and appatatus
JPS5267275A (en) Semiconductor unit