JPS5758781Y2 - - Google Patents

Info

Publication number
JPS5758781Y2
JPS5758781Y2 JP1977179052U JP17905277U JPS5758781Y2 JP S5758781 Y2 JPS5758781 Y2 JP S5758781Y2 JP 1977179052 U JP1977179052 U JP 1977179052U JP 17905277 U JP17905277 U JP 17905277U JP S5758781 Y2 JPS5758781 Y2 JP S5758781Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977179052U
Other versions
JPS54100567U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977179052U priority Critical patent/JPS5758781Y2/ja
Publication of JPS54100567U publication Critical patent/JPS54100567U/ja
Application granted granted Critical
Publication of JPS5758781Y2 publication Critical patent/JPS5758781Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1977179052U 1977-12-26 1977-12-26 Expired JPS5758781Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977179052U JPS5758781Y2 (ja) 1977-12-26 1977-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977179052U JPS5758781Y2 (ja) 1977-12-26 1977-12-26

Publications (2)

Publication Number Publication Date
JPS54100567U JPS54100567U (ja) 1979-07-16
JPS5758781Y2 true JPS5758781Y2 (ja) 1982-12-15

Family

ID=29190107

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977179052U Expired JPS5758781Y2 (ja) 1977-12-26 1977-12-26

Country Status (1)

Country Link
JP (1) JPS5758781Y2 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132332A (en) * 1981-02-09 1982-08-16 Hitachi Ltd Semiconductor device
JP5368357B2 (ja) * 2010-04-01 2013-12-18 三菱電機株式会社 電極部材およびこれを用いた半導体装置
JP7480715B2 (ja) * 2021-01-19 2024-05-10 三菱電機株式会社 半導体装置
CN114975128B (zh) * 2021-02-25 2025-03-11 珠海零边界集成电路有限公司 一种智能功率模块及其制备方法

Also Published As

Publication number Publication date
JPS54100567U (ja) 1979-07-16

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