JPS5765524A - Heat pipe - Google Patents

Heat pipe

Info

Publication number
JPS5765524A
JPS5765524A JP13962180A JP13962180A JPS5765524A JP S5765524 A JPS5765524 A JP S5765524A JP 13962180 A JP13962180 A JP 13962180A JP 13962180 A JP13962180 A JP 13962180A JP S5765524 A JPS5765524 A JP S5765524A
Authority
JP
Japan
Prior art keywords
main body
closing member
pipe part
bonding
closing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13962180A
Other languages
Japanese (ja)
Inventor
Hirokatsu Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP13962180A priority Critical patent/JPS5765524A/en
Publication of JPS5765524A publication Critical patent/JPS5765524A/en
Pending legal-status Critical Current

Links

Landscapes

  • Joining Of Glass To Other Materials (AREA)

Abstract

PURPOSE: To facilitate the closing of the ends of a heat pipe main body of the pipings used in an electronic apparatus by bonding a closing member to each of the ends of the main body with a lead glass based bond.
CONSTITUTION: The closing member 36 having a small pipe part 41 is bonded to each of the ends of the heat pipe main body by using a lead glass based bond 40 comprising a substance which has good compatibility with a working fluid such as water, a high mechanical strength after bonding and a melting point sufficiently higher than the working temperature of heating elements 6 such as semiconductor elements. Thereafter, the small pipe part 41 of one of the closing member 36 is subjected to fusion-bonding by heating or the like while rotating it with its axis as a center, and then the small pipe part 41 of the other closing member 36 is fusion bonded while extracting air from the interior of the main body 24 via a through- hole 42 of the pipe part 41 so as to evacuate the main body 24. Accordingly, the ends of the main body 24 are closed by the closing members 36 in a perfectly sealed condition under vacuum.
COPYRIGHT: (C)1982,JPO&Japio
JP13962180A 1980-10-06 1980-10-06 Heat pipe Pending JPS5765524A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13962180A JPS5765524A (en) 1980-10-06 1980-10-06 Heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13962180A JPS5765524A (en) 1980-10-06 1980-10-06 Heat pipe

Publications (1)

Publication Number Publication Date
JPS5765524A true JPS5765524A (en) 1982-04-21

Family

ID=15249543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13962180A Pending JPS5765524A (en) 1980-10-06 1980-10-06 Heat pipe

Country Status (1)

Country Link
JP (1) JPS5765524A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6199625B1 (en) 1999-06-11 2001-03-13 Psc Computer Products, Inc. Stackable heat sink for electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6199625B1 (en) 1999-06-11 2001-03-13 Psc Computer Products, Inc. Stackable heat sink for electronic components
US6450250B2 (en) * 1999-06-11 2002-09-17 Psc Computer Products, Inc. Stackable heat sink for electronic components

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