JPS5768061A - Lead material for semiconductor device - Google Patents

Lead material for semiconductor device

Info

Publication number
JPS5768061A
JPS5768061A JP55143908A JP14390880A JPS5768061A JP S5768061 A JPS5768061 A JP S5768061A JP 55143908 A JP55143908 A JP 55143908A JP 14390880 A JP14390880 A JP 14390880A JP S5768061 A JPS5768061 A JP S5768061A
Authority
JP
Japan
Prior art keywords
strength
heat resistance
elements
alloy
contained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55143908A
Other languages
Japanese (ja)
Other versions
JPS6332854B2 (en
Inventor
Kiichi Akasaka
Kozo Yamato
Shigeo Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP55143908A priority Critical patent/JPS5768061A/en
Publication of JPS5768061A publication Critical patent/JPS5768061A/en
Publication of JPS6332854B2 publication Critical patent/JPS6332854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To inexpensively produce a lead having excellent characteristics such as heat resistance, tensile strength, conductivity, etc. by employing as blank for lead frame an alloy of with predetermined ranges of Zn, Sn and Fe. CONSTITUTION:Elements of Zn, Sn, and Fe are contained 0.5-3.0wt% in the blank of a lead frame forming an IC or the like, with residue of Cu as a Cu alloy. The additions of Sn and Fe improve the strength and heat resistance, Zn improves the strength and the quality in the ingot. When the elements are contained less than 0.5wt%, sufficient strength and heat resistance cannot be obtained, while when the elements are contained more than 3.0wt%, the thermal and electrical conductivities and bending workability are lowered. For example, a plate of 0.3mm.thick can be formed by facing work of an ingot made of raw alloy, hot working it, then annealing and cold rolling it repeatedly. In this manner, the lead material of desired characteristics can be inexpensively produced.
JP55143908A 1980-10-15 1980-10-15 Lead material for semiconductor device Granted JPS5768061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55143908A JPS5768061A (en) 1980-10-15 1980-10-15 Lead material for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55143908A JPS5768061A (en) 1980-10-15 1980-10-15 Lead material for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5768061A true JPS5768061A (en) 1982-04-26
JPS6332854B2 JPS6332854B2 (en) 1988-07-01

Family

ID=15349871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55143908A Granted JPS5768061A (en) 1980-10-15 1980-10-15 Lead material for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5768061A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140341A (en) * 1983-01-29 1984-08-11 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPS605550A (en) * 1983-06-24 1985-01-12 Toshiba Corp Electronic parts
US5853505A (en) * 1997-04-18 1998-12-29 Olin Corporation Iron modified tin brass
US5882442A (en) * 1995-10-20 1999-03-16 Olin Corporation Iron modified phosphor-bronze
US6132528A (en) * 1997-04-18 2000-10-17 Olin Corporation Iron modified tin brass

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06304889A (en) * 1993-04-21 1994-11-01 Nakatetsuku Kk Sucker unit and cap boxing device using this sucker unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424811A (en) * 1977-07-27 1979-02-24 Hitachi Cable Ltd Copper alloy for lead conductor of semiconductor device
JPS5426219A (en) * 1977-07-30 1979-02-27 Furukawa Electric Co Ltd:The Electric conductive copper alloy of superior solderability

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424811A (en) * 1977-07-27 1979-02-24 Hitachi Cable Ltd Copper alloy for lead conductor of semiconductor device
JPS5426219A (en) * 1977-07-30 1979-02-27 Furukawa Electric Co Ltd:The Electric conductive copper alloy of superior solderability

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140341A (en) * 1983-01-29 1984-08-11 Furukawa Electric Co Ltd:The Copper alloy for lead frame
JPS605550A (en) * 1983-06-24 1985-01-12 Toshiba Corp Electronic parts
US5882442A (en) * 1995-10-20 1999-03-16 Olin Corporation Iron modified phosphor-bronze
US5853505A (en) * 1997-04-18 1998-12-29 Olin Corporation Iron modified tin brass
US6132528A (en) * 1997-04-18 2000-10-17 Olin Corporation Iron modified tin brass

Also Published As

Publication number Publication date
JPS6332854B2 (en) 1988-07-01

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