JPS5769740A - Warpage controller for semiconductor wafer - Google Patents
Warpage controller for semiconductor waferInfo
- Publication number
- JPS5769740A JPS5769740A JP55146426A JP14642680A JPS5769740A JP S5769740 A JPS5769740 A JP S5769740A JP 55146426 A JP55146426 A JP 55146426A JP 14642680 A JP14642680 A JP 14642680A JP S5769740 A JPS5769740 A JP S5769740A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- warpage
- semiconductor wafer
- controller
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To obtain a flatness capable of exposing and drawing accurately a wafer by emitting a laser of the output determined in response to the warpage and remaining stress to the semiconductor wafer, thereby controlling the warpage of the wafer. CONSTITUTION:A semiconductor wafer 5 fed via a conveying mechanism is placed on an X-Y stage 3. The flat state of the wafer 5 is measured by an optical micrometer 6 as a detected provided to be faced upwardly of the wafer 5. The measured value is compared with preinputted data, and the stage 3 is driven in accordance with the compared result. The wafer 5 is emitted under the emitting conditions based on the measured value by a laser beam L. In this manner, the warpage of the wafer 5 can be readily controlled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55146426A JPS5769740A (en) | 1980-10-20 | 1980-10-20 | Warpage controller for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55146426A JPS5769740A (en) | 1980-10-20 | 1980-10-20 | Warpage controller for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5769740A true JPS5769740A (en) | 1982-04-28 |
Family
ID=15407407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55146426A Pending JPS5769740A (en) | 1980-10-20 | 1980-10-20 | Warpage controller for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5769740A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0318733A (en) * | 1989-06-16 | 1991-01-28 | Hitachi Ltd | Stress monitoring method and device |
| JPH0612105U (en) * | 1992-07-20 | 1994-02-15 | 小泉産業株式会社 | Chair casters |
| DE112015001699B4 (en) | 2014-05-01 | 2022-01-20 | Shin-Etsu Handotai Co., Ltd. | Method of evaluating warpage of a wafer and method of selecting a wafer |
-
1980
- 1980-10-20 JP JP55146426A patent/JPS5769740A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0318733A (en) * | 1989-06-16 | 1991-01-28 | Hitachi Ltd | Stress monitoring method and device |
| JPH0612105U (en) * | 1992-07-20 | 1994-02-15 | 小泉産業株式会社 | Chair casters |
| DE112015001699B4 (en) | 2014-05-01 | 2022-01-20 | Shin-Etsu Handotai Co., Ltd. | Method of evaluating warpage of a wafer and method of selecting a wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5727087A (en) | Wavelength sweeping laser | |
| JPS5769740A (en) | Warpage controller for semiconductor wafer | |
| CA2038334A1 (en) | Apparatus and method for detecting the power level in single and multi-stripe integrated lasers | |
| EP0390525A3 (en) | An optical pumping-type solid-state laser apparatus with a semiconductor laser device | |
| JPS6427286A (en) | Semiconductor device | |
| JPS57162441A (en) | Automatic wafer tester | |
| JPS5437485A (en) | Output stabilizing method for semiconductor laser | |
| JPS57159285A (en) | Laser working device | |
| JPS56158494A (en) | Output control device for semiconductor laser | |
| JPS566468A (en) | Semiconductor integrated device | |
| JPS57159286A (en) | Laser working device | |
| JPS51132983A (en) | Linear light output luminous semiconductor device | |
| JPS57149780A (en) | Photo transmission circuit and photo semiconductor | |
| JPS55113390A (en) | Semiconductor laser device | |
| JPS5759346A (en) | Auxiliary holder for semiconductor substrate | |
| JPS5476248A (en) | Light control circuit | |
| JPS6489579A (en) | Fiber laser device | |
| JPS57108702A (en) | Displacement meter | |
| JPS5752807A (en) | Device for measuring film thickness | |
| JPS5754319A (en) | Electron-beam exposing device | |
| JPS5766650A (en) | Manufacture of semiconductor device | |
| JPS5215280A (en) | Cleavage semiconductor laser equipped with side surface light take-out waveguide | |
| JPS57172308A (en) | Coupling method of semiconductor laser and optical waveguide | |
| JPS5372451A (en) | Laser scriber unit | |
| JPS5371A (en) | Scribing method of semiconductor wafer |