JPS5769747A - Wafer conveying device in liquid - Google Patents

Wafer conveying device in liquid

Info

Publication number
JPS5769747A
JPS5769747A JP55144338A JP14433880A JPS5769747A JP S5769747 A JPS5769747 A JP S5769747A JP 55144338 A JP55144338 A JP 55144338A JP 14433880 A JP14433880 A JP 14433880A JP S5769747 A JPS5769747 A JP S5769747A
Authority
JP
Japan
Prior art keywords
wafer
conveying
liquid
hole
conveying device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55144338A
Other languages
Japanese (ja)
Inventor
Masato Sotojima
Atsushi Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP55144338A priority Critical patent/JPS5769747A/en
Publication of JPS5769747A publication Critical patent/JPS5769747A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H10P72/3602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Delivering By Means Of Belts And Rollers (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To improve the conveying performance and durability of a wafer weight a simple configuration by arranging a hole floating a wafer under the wafer by a wafer conveying device in liquid and a hole for injecting for propelling it in a conveying direction along a conveying route. CONSTITUTION:A wafer conveying route 1 is formed in a channel structure, and a wafer floating bubble blowing hole 2 at both axial sides and wafer propelling fluid blowing hole 3 at the center are aligned along the conveying direction. The wafer in the liquid is floated by the air bubble upwardly from the hole 2, and is conveyed in the liquid spraying direction by the gas or liquid from the hole 3. In this manner, the conveying performance and the durability can be improved in the wafer conveying device.
JP55144338A 1980-10-17 1980-10-17 Wafer conveying device in liquid Pending JPS5769747A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55144338A JPS5769747A (en) 1980-10-17 1980-10-17 Wafer conveying device in liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55144338A JPS5769747A (en) 1980-10-17 1980-10-17 Wafer conveying device in liquid

Publications (1)

Publication Number Publication Date
JPS5769747A true JPS5769747A (en) 1982-04-28

Family

ID=15359779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55144338A Pending JPS5769747A (en) 1980-10-17 1980-10-17 Wafer conveying device in liquid

Country Status (1)

Country Link
JP (1) JPS5769747A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138235U (en) * 1983-03-04 1984-09-14 株式会社不二越 Silicon wafer transport equipment
JPS6025141U (en) * 1983-07-27 1985-02-20 富士通株式会社 cleaning nozzle
JPH02209317A (en) * 1989-02-08 1990-08-20 Toshiba Ceramics Co Ltd Carrier device
EP2947686A1 (en) * 2014-05-19 2015-11-25 Meyer Burger AG Wafer processing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138235U (en) * 1983-03-04 1984-09-14 株式会社不二越 Silicon wafer transport equipment
JPS6025141U (en) * 1983-07-27 1985-02-20 富士通株式会社 cleaning nozzle
JPH02209317A (en) * 1989-02-08 1990-08-20 Toshiba Ceramics Co Ltd Carrier device
EP2947686A1 (en) * 2014-05-19 2015-11-25 Meyer Burger AG Wafer processing method

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