JPS5769770A - Preliminary soldering method of outside leads - Google Patents
Preliminary soldering method of outside leadsInfo
- Publication number
- JPS5769770A JPS5769770A JP14574880A JP14574880A JPS5769770A JP S5769770 A JPS5769770 A JP S5769770A JP 14574880 A JP14574880 A JP 14574880A JP 14574880 A JP14574880 A JP 14574880A JP S5769770 A JPS5769770 A JP S5769770A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- solder
- outside leads
- supporting arm
- fulcrum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000005476 soldering Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 6
- 229910000679 solder Inorganic materials 0.000 abstract 6
- 239000007788 liquid Substances 0.000 abstract 2
- 238000005422 blasting Methods 0.000 abstract 1
- 238000007664 blowing Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 238000007790 scraping Methods 0.000 abstract 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To perform preliminary soldering of outside leads of a semiconductor device by immersion soldering generating no defect of bridge or lump, etc., by a method wherein the semiconductor device is drawn up from the liquid surface of solder shaking off solder applying vibration to the semiconductor device. CONSTITUTION:The semiconductor device 10 is holded by a supporting arm 21. The supporting arm 21 is made to move upward and downward by action of a fulcrum 22, a Z axis pulse motor 23 and an up-and-down motion cam 24, and the outside leads 11 are immersed in the melted solder 13 and are drawn up. Vibration to be applied to the semiconductor device is given by coupling a sliding plate 25 supporting the supporting arm 21 by the fulcrum 22 to a vibrator 26. The method to draw up the semiconductor device from the solder liquid surface scraping off the solder between the outside leads using a comb type plate, or to draw up the device blowing off the solder blasting heated inert gas may be also used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14574880A JPS5769770A (en) | 1980-10-20 | 1980-10-20 | Preliminary soldering method of outside leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14574880A JPS5769770A (en) | 1980-10-20 | 1980-10-20 | Preliminary soldering method of outside leads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5769770A true JPS5769770A (en) | 1982-04-28 |
Family
ID=15392234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14574880A Pending JPS5769770A (en) | 1980-10-20 | 1980-10-20 | Preliminary soldering method of outside leads |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5769770A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5937747U (en) * | 1982-08-31 | 1984-03-09 | 富士通株式会社 | semiconductor equipment |
| JPS61232650A (en) * | 1985-04-09 | 1986-10-16 | Tamura Seisakusho Co Ltd | Soldering method and device thereof |
-
1980
- 1980-10-20 JP JP14574880A patent/JPS5769770A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5937747U (en) * | 1982-08-31 | 1984-03-09 | 富士通株式会社 | semiconductor equipment |
| JPS61232650A (en) * | 1985-04-09 | 1986-10-16 | Tamura Seisakusho Co Ltd | Soldering method and device thereof |
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