JPS577133A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS577133A
JPS577133A JP8015880A JP8015880A JPS577133A JP S577133 A JPS577133 A JP S577133A JP 8015880 A JP8015880 A JP 8015880A JP 8015880 A JP8015880 A JP 8015880A JP S577133 A JPS577133 A JP S577133A
Authority
JP
Japan
Prior art keywords
void
carrying table
wax material
adhesivity
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8015880A
Other languages
Japanese (ja)
Inventor
Tatsuo Oketa
Fumio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8015880A priority Critical patent/JPS577133A/en
Publication of JPS577133A publication Critical patent/JPS577133A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To improve the adhesivity between an element and a carrying table by stopping frictional vibraion based on a detected information regarding a void generated in a wax material. CONSTITUTION:An element 3 is placed on a carrying table 1 of a lead frame 4 through a wax material 2. While the carrying table 1 is heated, the element 3 is subjected to a frictional vibration so that the wax may be melted thereby making the alloy wet on the interface. Under such a condition, an X ray flaw detector 5 is used to project an image the transmission through the void 6 generated in the wax material thereby detecting the quantity of the void in an area measurably with an analyzer 8. Based on the computation of the detected data, it is so controlled that vibration is continued until the quantity of the void reduces to a fixed value, for example, about 15-20% of the element area and then, is stopped to fix the element. This can improve the mechanical and electrical adhesivity and thus assures a high reliability.
JP8015880A 1980-06-16 1980-06-16 Manufacture of semiconductor device Pending JPS577133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8015880A JPS577133A (en) 1980-06-16 1980-06-16 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8015880A JPS577133A (en) 1980-06-16 1980-06-16 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS577133A true JPS577133A (en) 1982-01-14

Family

ID=13710487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8015880A Pending JPS577133A (en) 1980-06-16 1980-06-16 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS577133A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269627A (en) * 1985-09-24 1987-03-30 Toshiba Corp Method and device for mounting semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269627A (en) * 1985-09-24 1987-03-30 Toshiba Corp Method and device for mounting semiconductor element

Similar Documents

Publication Publication Date Title
FR2523791B1 (en) DEVICE AND APPARATUS FOR TESTING ELECTRONIC EQUIPMENT, PARTICULARLY TELEVISION
DE3474067D1 (en) Process and apparatus for the detection and quantification of agglutinates
MY105336A (en) Method and system for concurrent electronic component testing and lead verification
EP0092027A3 (en) Local temperature rise monitor for electrical apparatus
JPS577133A (en) Manufacture of semiconductor device
SE8304114L (en) SELF-STANDING DEVICE FOR GENERATING TIME DELAY
JPS5717871A (en) Environment test device
JPS5353261A (en) Electronic device
JPS5663275A (en) Lead testing device for semiconductor device
DE68913902D1 (en) Integrated circuit with a signal discrimination circuit and method for testing it.
JPS57122544A (en) Semiconductor device
JPS5353260A (en) Electronic device
JPS5318972A (en) Monitoring method of wafer positioning state by probes
JPS58183681U (en) Cassette tape X-ray inspection device
SE8107026L (en) ELECTRONIC METHOD DEVICE
JPS5289368A (en) Automatic hardness measuring apparatus
Devine Ultrasonic Beam Lead Bonding Equipment.
ES438279A1 (en) Apparatus and method for detecting a substance in a fluid medium
Tamura et al. Evaluation of optical fibers for space use
JPS5355970A (en) Electronic device
JPS5225659A (en) Device for measurement and inspection
COURTOIS et al. On-line and off-line test: Classification and recent results
GARNIER Failures affecting reliability of avionic systems
JPS58109873A (en) Detector for irradiation quantity of neutron
JPS52143398A (en) Core abnormal detecting device