JPS5773952U - - Google Patents
Info
- Publication number
- JPS5773952U JPS5773952U JP12979680U JP12979680U JPS5773952U JP S5773952 U JPS5773952 U JP S5773952U JP 12979680 U JP12979680 U JP 12979680U JP 12979680 U JP12979680 U JP 12979680U JP S5773952 U JPS5773952 U JP S5773952U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12979680U JPS5773952U (en) | 1980-09-11 | 1980-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12979680U JPS5773952U (en) | 1980-09-11 | 1980-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5773952U true JPS5773952U (en) | 1982-05-07 |
Family
ID=29490126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12979680U Pending JPS5773952U (en) | 1980-09-11 | 1980-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5773952U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6960828B2 (en) | 2002-06-25 | 2005-11-01 | Unitive International Limited | Electronic structures including conductive shunt layers |
| US7049216B2 (en) | 2003-10-14 | 2006-05-23 | Unitive International Limited | Methods of providing solder structures for out plane connections |
| US7081404B2 (en) | 2003-02-18 | 2006-07-25 | Unitive Electronics Inc. | Methods of selectively bumping integrated circuit substrates and related structures |
| US7156284B2 (en) | 2000-12-15 | 2007-01-02 | Unitive International Limited | Low temperature methods of bonding components and related structures |
| US7213740B2 (en) | 2000-11-10 | 2007-05-08 | Unitive International Limited | Optical structures including liquid bumps and related methods |
| US7358174B2 (en) | 2004-04-13 | 2008-04-15 | Amkor Technology, Inc. | Methods of forming solder bumps on exposed metal pads |
| US7531898B2 (en) | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
| US7547623B2 (en) | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
-
1980
- 1980-09-11 JP JP12979680U patent/JPS5773952U/ja active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7213740B2 (en) | 2000-11-10 | 2007-05-08 | Unitive International Limited | Optical structures including liquid bumps and related methods |
| US7156284B2 (en) | 2000-12-15 | 2007-01-02 | Unitive International Limited | Low temperature methods of bonding components and related structures |
| US6960828B2 (en) | 2002-06-25 | 2005-11-01 | Unitive International Limited | Electronic structures including conductive shunt layers |
| US7297631B2 (en) | 2002-06-25 | 2007-11-20 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
| US7531898B2 (en) | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
| US7547623B2 (en) | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
| US7081404B2 (en) | 2003-02-18 | 2006-07-25 | Unitive Electronics Inc. | Methods of selectively bumping integrated circuit substrates and related structures |
| US7579694B2 (en) | 2003-02-18 | 2009-08-25 | Unitive International Limited | Electronic devices including offset conductive bumps |
| US7049216B2 (en) | 2003-10-14 | 2006-05-23 | Unitive International Limited | Methods of providing solder structures for out plane connections |
| US7358174B2 (en) | 2004-04-13 | 2008-04-15 | Amkor Technology, Inc. | Methods of forming solder bumps on exposed metal pads |