JPS5775449A - Manufacture of airtight terminal - Google Patents

Manufacture of airtight terminal

Info

Publication number
JPS5775449A
JPS5775449A JP55151635A JP15163580A JPS5775449A JP S5775449 A JPS5775449 A JP S5775449A JP 55151635 A JP55151635 A JP 55151635A JP 15163580 A JP15163580 A JP 15163580A JP S5775449 A JPS5775449 A JP S5775449A
Authority
JP
Japan
Prior art keywords
layer
pipe lead
copper
flat part
airtight terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55151635A
Other languages
Japanese (ja)
Other versions
JPS618586B2 (en
Inventor
Koichi Komoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP55151635A priority Critical patent/JPS5775449A/en
Publication of JPS5775449A publication Critical patent/JPS5775449A/en
Publication of JPS618586B2 publication Critical patent/JPS618586B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To manufacture the airtight terminal characterized by excellent airtightness by forming a copper plated layer at least on the inner surface of a pipe lead, and then crushing one end thereof to obtain a flat shape, and airtightly blocking the crushed flat part by copper braze. CONSTITUTION:The copper plated layer 14 is formed over the entire surface of the pipe lead 13. Then, one end thereof is compressed and the crushed flat part 15 is formed. Then the exposed layer 14 is separated. Thereafter the heating is performed up to the temperature higher than the melting point of the layer 14, and the layer 14 is fused and the copper braze 16 is obtained. The flat part 15 is blocked airtightly by said copper braze 16. Then, by using a sealing jig 17, the pipe lead 13 is assembled at a specified position together with a metallic outer ring 11 and a sintered glass doublet 12a. The outer ring 11 and the pipe lead 13 are sealed airtightly via glass 12. Thus, the airtight terminal characterized by excellent airtightness can be readily manufactured.
JP55151635A 1980-10-29 1980-10-29 Manufacture of airtight terminal Granted JPS5775449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55151635A JPS5775449A (en) 1980-10-29 1980-10-29 Manufacture of airtight terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55151635A JPS5775449A (en) 1980-10-29 1980-10-29 Manufacture of airtight terminal

Publications (2)

Publication Number Publication Date
JPS5775449A true JPS5775449A (en) 1982-05-12
JPS618586B2 JPS618586B2 (en) 1986-03-15

Family

ID=15522847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55151635A Granted JPS5775449A (en) 1980-10-29 1980-10-29 Manufacture of airtight terminal

Country Status (1)

Country Link
JP (1) JPS5775449A (en)

Also Published As

Publication number Publication date
JPS618586B2 (en) 1986-03-15

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