JPS5776852A - Card for probe - Google Patents

Card for probe

Info

Publication number
JPS5776852A
JPS5776852A JP15259080A JP15259080A JPS5776852A JP S5776852 A JPS5776852 A JP S5776852A JP 15259080 A JP15259080 A JP 15259080A JP 15259080 A JP15259080 A JP 15259080A JP S5776852 A JPS5776852 A JP S5776852A
Authority
JP
Japan
Prior art keywords
wafer
temperature
probe
measuring
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15259080A
Other languages
Japanese (ja)
Other versions
JPS6118338B2 (en
Inventor
Toshimi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15259080A priority Critical patent/JPS5776852A/en
Publication of JPS5776852A publication Critical patent/JPS5776852A/en
Publication of JPS6118338B2 publication Critical patent/JPS6118338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To measure the temperature of the surface of a semiconductor wafer without damaging an integrated circuit element on the wafer by also contacting a temperature detecting terminal for measuring the temperature of the surface of the wafer with the semiconductor wafer when the probe and the semiconductor wafer contact. CONSTITUTION:The temperature of the surface of the wafer 4 placed on a wafer chuck 5 is detected as the change of an electrical element through contact between the probe 2 mounted to the probe card 1 and the temperature detecting terminal 3 measuring the temperature of the surface of the wafer 4 in the wafer 4, and the temperature is measured by means of an external measuring instrument. Accordingly, a temperature condition can be added to the inspection of the characteristics of the integrated circuit element or the heating or cooling of the wafer can be controlled automaticall by feeding back temperature data to the heating or cooling.
JP15259080A 1980-10-30 1980-10-30 Card for probe Granted JPS5776852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15259080A JPS5776852A (en) 1980-10-30 1980-10-30 Card for probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15259080A JPS5776852A (en) 1980-10-30 1980-10-30 Card for probe

Publications (2)

Publication Number Publication Date
JPS5776852A true JPS5776852A (en) 1982-05-14
JPS6118338B2 JPS6118338B2 (en) 1986-05-12

Family

ID=15543765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15259080A Granted JPS5776852A (en) 1980-10-30 1980-10-30 Card for probe

Country Status (1)

Country Link
JP (1) JPS5776852A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154636A (en) * 1985-12-27 1987-07-09 Hitachi Electronics Eng Co Ltd Cvd thin film forming apparatus
JP2007227444A (en) * 2006-02-21 2007-09-06 Ricoh Co Ltd IC test method, probe card, inspection prober, and IC test apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62154636A (en) * 1985-12-27 1987-07-09 Hitachi Electronics Eng Co Ltd Cvd thin film forming apparatus
JP2007227444A (en) * 2006-02-21 2007-09-06 Ricoh Co Ltd IC test method, probe card, inspection prober, and IC test apparatus

Also Published As

Publication number Publication date
JPS6118338B2 (en) 1986-05-12

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