JPS5776868A - Forming method for resin protected film - Google Patents

Forming method for resin protected film

Info

Publication number
JPS5776868A
JPS5776868A JP55152511A JP15251180A JPS5776868A JP S5776868 A JPS5776868 A JP S5776868A JP 55152511 A JP55152511 A JP 55152511A JP 15251180 A JP15251180 A JP 15251180A JP S5776868 A JPS5776868 A JP S5776868A
Authority
JP
Japan
Prior art keywords
frame
polyimide
solution
forming method
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55152511A
Other languages
Japanese (ja)
Inventor
Haruo Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55152511A priority Critical patent/JPS5776868A/en
Publication of JPS5776868A publication Critical patent/JPS5776868A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To form the resin film which protects the stored content of a MOS memory from trouble due to gamma-rays by a method wherein a frame in resin is shaped to the surface of a semiconductor substrate, and a solution of a high molecular material is dropped into the frame, and cured. CONSTITUTION:The frame 3 in polyimide is pasted surrounding a region 4 to be protected of the surface of the semiconductor chip 1. The polyimide solution 5 only for coating the whole surface in the frame in necessary thickness is dropped into the frame, and the surface is coated with a solution layer 5' in necessary thickness. A solvent is volatilized through heat treatment, and a polyimide film is shaped.
JP55152511A 1980-10-30 1980-10-30 Forming method for resin protected film Pending JPS5776868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55152511A JPS5776868A (en) 1980-10-30 1980-10-30 Forming method for resin protected film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55152511A JPS5776868A (en) 1980-10-30 1980-10-30 Forming method for resin protected film

Publications (1)

Publication Number Publication Date
JPS5776868A true JPS5776868A (en) 1982-05-14

Family

ID=15542044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55152511A Pending JPS5776868A (en) 1980-10-30 1980-10-30 Forming method for resin protected film

Country Status (1)

Country Link
JP (1) JPS5776868A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828860A (en) * 1981-08-12 1983-02-19 Nec Corp Semiconductor device and manufacture thereof
JPH02271547A (en) * 1989-04-12 1990-11-06 Nec Corp Film carrier-type semiconductor device
JPH0319259A (en) * 1989-06-15 1991-01-28 Nec Corp Semiconductor device
US5229329A (en) * 1991-02-28 1993-07-20 Texas Instruments, Incorporated Method of manufacturing insulated lead frame for integrated circuits
US5434105A (en) * 1994-03-04 1995-07-18 National Semiconductor Corporation Process for attaching a lead frame to a heat sink using a glob-top encapsulation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4943873U (en) * 1972-07-20 1974-04-17
JPS55128851A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor memory device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4943873U (en) * 1972-07-20 1974-04-17
JPS55128851A (en) * 1979-03-28 1980-10-06 Hitachi Ltd Semiconductor memory device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828860A (en) * 1981-08-12 1983-02-19 Nec Corp Semiconductor device and manufacture thereof
JPH02271547A (en) * 1989-04-12 1990-11-06 Nec Corp Film carrier-type semiconductor device
JPH0319259A (en) * 1989-06-15 1991-01-28 Nec Corp Semiconductor device
US5229329A (en) * 1991-02-28 1993-07-20 Texas Instruments, Incorporated Method of manufacturing insulated lead frame for integrated circuits
US5434105A (en) * 1994-03-04 1995-07-18 National Semiconductor Corporation Process for attaching a lead frame to a heat sink using a glob-top encapsulation
US5581119A (en) * 1994-03-04 1996-12-03 National Semiconductor Corporation IC having heat spreader attached by glob-topping

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