JPS5778449A - Phenolic resin molding material - Google Patents

Phenolic resin molding material

Info

Publication number
JPS5778449A
JPS5778449A JP15491580A JP15491580A JPS5778449A JP S5778449 A JPS5778449 A JP S5778449A JP 15491580 A JP15491580 A JP 15491580A JP 15491580 A JP15491580 A JP 15491580A JP S5778449 A JPS5778449 A JP S5778449A
Authority
JP
Japan
Prior art keywords
phenol resin
molding material
wood chips
resin
resol type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15491580A
Other languages
Japanese (ja)
Inventor
Etsukazu Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15491580A priority Critical patent/JPS5778449A/en
Publication of JPS5778449A publication Critical patent/JPS5778449A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To obtain a molding material capable fo giving moldings having a high strength and high dimensional stability and suitable for wiring parts, electrical appliances, etc., by adding wood chips coated with resol type phenol resin having a specific grain size, as a filler to a phenolic resin.
CONSTITUTION: One hundred pts.wt. wood chips of a grain size enough to pass 4-mesh screen but to stay on 200-mesh screen, specified by JIS, are mixed with 10W30pts.wt. resol type phenol resin to obtain wood chips coated with the phenol resin. Then, a phenol resin (A) (e.g., a mixture of novolak or resol type phenol resin and a curing agent) is mixed with said wood chips (B) coated with the phenol resin to obtain a phenolic resin molding material.
EFFECT: Since the filler of great apparent density is used, the amount of the resin to be absorbed is reduced, and since the visocisty of the molding material during molding is low, molding under low pressure is made possible.
COPYRIGHT: (C)1982,JPO&Japio
JP15491580A 1980-11-04 1980-11-04 Phenolic resin molding material Pending JPS5778449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15491580A JPS5778449A (en) 1980-11-04 1980-11-04 Phenolic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15491580A JPS5778449A (en) 1980-11-04 1980-11-04 Phenolic resin molding material

Publications (1)

Publication Number Publication Date
JPS5778449A true JPS5778449A (en) 1982-05-17

Family

ID=15594735

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15491580A Pending JPS5778449A (en) 1980-11-04 1980-11-04 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JPS5778449A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142556A (en) * 1984-08-06 1986-03-01 Sumitomo Bakelite Co Ltd Phenolic resin molding material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142556A (en) * 1984-08-06 1986-03-01 Sumitomo Bakelite Co Ltd Phenolic resin molding material

Similar Documents

Publication Publication Date Title
JPS5679170A (en) Adhesive composition
JPS51129498A (en) Thermosetting resin composition
JPS5778450A (en) Phenolic resin molding material
JPS5772750A (en) Binder composition for mold
JPS5346394A (en) Preparation of resol type-phenol resin
JPS5778447A (en) Phenolic resin molding material
JPS53123457A (en) Molding resin composition
JPS5390400A (en) Powdery epoxy resin composition
JPS51150595A (en) Resin composition for use in surface coating
JPS53127599A (en) Epoxy resin composition
JPS57172930A (en) Prepreg sheet
JPS57174314A (en) Epoxy resin composition
JPS53129292A (en) Curing of caking agent
JPS5225843A (en) Polyolefin resin composition
JPS5698227A (en) Epoxy resin composition
JPS54148866A (en) Manufacture of epoxy resin bonding sheet
JPS5757711A (en) Resin composition for low-pressure molding
JPS5396084A (en) Adhesion of reinforcing material to rubber through curing process
JPS55106257A (en) Phenol resin composition for molding
JPS5734120A (en) Epoxy resin composition
JPS5437200A (en) Epoxy resin composition
JPS57128763A (en) Adhesive for resin-rich wood
JPS5394528A (en) Phenolic resin molding material and method of molding the same
JPS53111398A (en) Epoxy resin composition
JPS5725322A (en) Epoxy resin composition