JPS5780837U - - Google Patents
Info
- Publication number
- JPS5780837U JPS5780837U JP1980156207U JP15620780U JPS5780837U JP S5780837 U JPS5780837 U JP S5780837U JP 1980156207 U JP1980156207 U JP 1980156207U JP 15620780 U JP15620780 U JP 15620780U JP S5780837 U JPS5780837 U JP S5780837U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980156207U JPS5780837U (2) | 1980-10-31 | 1980-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980156207U JPS5780837U (2) | 1980-10-31 | 1980-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5780837U true JPS5780837U (2) | 1982-05-19 |
Family
ID=29515378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980156207U Pending JPS5780837U (2) | 1980-10-31 | 1980-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5780837U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58166755A (ja) * | 1982-03-29 | 1983-10-01 | Hitachi Ltd | 回路アセンブリ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5110365A (en) * | 1974-07-15 | 1976-01-27 | Suwa Seikosha Kk | Puremoorudoshikidenshikairo |
-
1980
- 1980-10-31 JP JP1980156207U patent/JPS5780837U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5110365A (en) * | 1974-07-15 | 1976-01-27 | Suwa Seikosha Kk | Puremoorudoshikidenshikairo |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58166755A (ja) * | 1982-03-29 | 1983-10-01 | Hitachi Ltd | 回路アセンブリ |