JPS578138A - Mold for resin sealing - Google Patents

Mold for resin sealing

Info

Publication number
JPS578138A
JPS578138A JP8136480A JP8136480A JPS578138A JP S578138 A JPS578138 A JP S578138A JP 8136480 A JP8136480 A JP 8136480A JP 8136480 A JP8136480 A JP 8136480A JP S578138 A JPS578138 A JP S578138A
Authority
JP
Japan
Prior art keywords
resin
mold
pot
runner
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8136480A
Other languages
Japanese (ja)
Inventor
Masahiko Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8136480A priority Critical patent/JPS578138A/en
Publication of JPS578138A publication Critical patent/JPS578138A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2703—Means for controlling the runner flow, e.g. runner switches, adjustable runners or gates
    • B29C45/2704—Controlling the filling rates or the filling times of two or more mould cavities by controlling the cross section or the length of the runners or the gates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To provide a mold by which semiconductor elements on a lead frame can be uniformly seald with a resin, by a method wherein the length and shape of a runner extending from pot to each cavity is suitably varied to equalize the dwelling time of the resin. CONSTITUTION:In the mold 11 for resin-sealing the semiconductor elements on the lead frame, the length and shape of the runner 13 leading from the pot 12 to each of the cavities 141-145 is suitably varied so as to equalize the period of time required for the resin to be fed from the pot 12 into each of the cavities 141-145 through a main runner 15 and auxiliary runners 161-165 which are branched from the main runner 15.
JP8136480A 1980-06-18 1980-06-18 Mold for resin sealing Pending JPS578138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8136480A JPS578138A (en) 1980-06-18 1980-06-18 Mold for resin sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8136480A JPS578138A (en) 1980-06-18 1980-06-18 Mold for resin sealing

Publications (1)

Publication Number Publication Date
JPS578138A true JPS578138A (en) 1982-01-16

Family

ID=13744268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8136480A Pending JPS578138A (en) 1980-06-18 1980-06-18 Mold for resin sealing

Country Status (1)

Country Link
JP (1) JPS578138A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59155113U (en) * 1983-04-02 1984-10-18 ロ−ム株式会社 mold die
US5624691A (en) * 1994-06-21 1997-04-29 Texas Instruments Incorporated Transfer mold design
US5672550A (en) * 1995-01-10 1997-09-30 Rohm Co., Ltd. Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame
US6015280A (en) * 1997-04-28 2000-01-18 Advanced Micro Devices Apparatus for reducing warping of plastic packages
KR100423131B1 (en) * 1999-11-01 2004-03-18 앰코 테크놀로지 코리아 주식회사 Substrate for manufacturing semiconductor package
CN102092121A (en) * 2010-12-09 2011-06-15 浙江德玛克机械有限公司 Injection-mould hot runner plate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59155113U (en) * 1983-04-02 1984-10-18 ロ−ム株式会社 mold die
US5624691A (en) * 1994-06-21 1997-04-29 Texas Instruments Incorporated Transfer mold design
US5744083A (en) * 1994-06-21 1998-04-28 Texas Instruments Incorporated Method for molding semiconductor packages
US5672550A (en) * 1995-01-10 1997-09-30 Rohm Co., Ltd. Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame
US6015280A (en) * 1997-04-28 2000-01-18 Advanced Micro Devices Apparatus for reducing warping of plastic packages
KR100423131B1 (en) * 1999-11-01 2004-03-18 앰코 테크놀로지 코리아 주식회사 Substrate for manufacturing semiconductor package
CN102092121A (en) * 2010-12-09 2011-06-15 浙江德玛克机械有限公司 Injection-mould hot runner plate

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