JPS578253A - Resin composition - Google Patents

Resin composition

Info

Publication number
JPS578253A
JPS578253A JP8484080A JP8484080A JPS578253A JP S578253 A JPS578253 A JP S578253A JP 8484080 A JP8484080 A JP 8484080A JP 8484080 A JP8484080 A JP 8484080A JP S578253 A JPS578253 A JP S578253A
Authority
JP
Japan
Prior art keywords
epoxy resin
aliph
methylolmelamine
shellac
bisphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8484080A
Other languages
Japanese (ja)
Inventor
Hiroshi Ono
Megumi Ooshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8484080A priority Critical patent/JPS578253A/en
Publication of JPS578253A publication Critical patent/JPS578253A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To provide a compsn. having low slipperiness and low hot compressibility which is suitable for mica bond for commutators, consisting of shellac, a bisphenol A type epoxy resin, a cyclic aliph. epoxy resin, methylolmelamine and a boron trifluoride complex compd.
CONSTITUTION: 100pts.wt. Shellac, 2W40pts.wt. bisphenol A type epoxy resin, 2W 50pts.wt. cyclic aliph. epoxy resin, 1W15pts.wt. methylolmelamine or an alcohol ether thereof, and 0.05W2pts.wt. boron trifluoride complex compd. (e.g. BF3- triphenylphosphin complex), are blended together to produce the desired resin compsn.
COPYRIGHT: (C)1982,JPO&Japio
JP8484080A 1980-06-19 1980-06-19 Resin composition Pending JPS578253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8484080A JPS578253A (en) 1980-06-19 1980-06-19 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8484080A JPS578253A (en) 1980-06-19 1980-06-19 Resin composition

Publications (1)

Publication Number Publication Date
JPS578253A true JPS578253A (en) 1982-01-16

Family

ID=13841982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8484080A Pending JPS578253A (en) 1980-06-19 1980-06-19 Resin composition

Country Status (1)

Country Link
JP (1) JPS578253A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01237202A (en) * 1988-02-04 1989-09-21 Sumitomo Rubber Ind Ltd Pneumatic tire and composition thereof
JP2007134361A (en) * 2005-11-08 2007-05-31 Tokai Carbon Co Ltd Colorant and resin composition for semiconductor encapsulant

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01237202A (en) * 1988-02-04 1989-09-21 Sumitomo Rubber Ind Ltd Pneumatic tire and composition thereof
JP2007134361A (en) * 2005-11-08 2007-05-31 Tokai Carbon Co Ltd Colorant and resin composition for semiconductor encapsulant

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