JPS5791544A - Cooling device for semiconductor element - Google Patents

Cooling device for semiconductor element

Info

Publication number
JPS5791544A
JPS5791544A JP55166604A JP16660480A JPS5791544A JP S5791544 A JPS5791544 A JP S5791544A JP 55166604 A JP55166604 A JP 55166604A JP 16660480 A JP16660480 A JP 16660480A JP S5791544 A JPS5791544 A JP S5791544A
Authority
JP
Japan
Prior art keywords
coolant
liquid
chamber
gas
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55166604A
Other languages
Japanese (ja)
Inventor
Kinji Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Denki Seizo KK
Toyo Electric Manufacturing Ltd
Original Assignee
Toyo Denki Seizo KK
Toyo Electric Manufacturing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Denki Seizo KK, Toyo Electric Manufacturing Ltd filed Critical Toyo Denki Seizo KK
Priority to JP55166604A priority Critical patent/JPS5791544A/en
Publication of JPS5791544A publication Critical patent/JPS5791544A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To obtain stable and high cooling function by allowing cooling gas and liquid not to disturb their moving direction to each other. CONSTITUTION:A plurality of hollow cooling pieces B' alternately laminated with semiconductor elements and clamped under pressure by a clamping and pressing mechanism 1 are respectively connected at the upper parts underneath a liquid reservoir 4' via coolant flow passages 3. The reservoir 4' is divided therein with partition plate 10 into upper and lower sections, the upper section is as a coolant gas chamber 42, the lower section is as a coolant liquid chamber 41, and condensed coolant liquid 9 is filled. The chamber 42 is connected via a boiling gas transport tube 7 to a condenser 6, which is connected to the chamber 41 via a condensed liquid return tube 8. An auxiliary tube 11 for intro- ducing the coolant gas in the cooling pieces B' is provided. In this manner, the coolant liquid 9 can be smoothly supplied to the cooling pieces B'.
JP55166604A 1980-11-28 1980-11-28 Cooling device for semiconductor element Pending JPS5791544A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55166604A JPS5791544A (en) 1980-11-28 1980-11-28 Cooling device for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55166604A JPS5791544A (en) 1980-11-28 1980-11-28 Cooling device for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5791544A true JPS5791544A (en) 1982-06-07

Family

ID=15834368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55166604A Pending JPS5791544A (en) 1980-11-28 1980-11-28 Cooling device for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5791544A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604028A1 (en) * 1986-09-16 1988-03-18 Alsthom SEMICONDUCTOR COOLING DEVICE BY VAPORIZING A REFRIGERATION FLUID

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2604028A1 (en) * 1986-09-16 1988-03-18 Alsthom SEMICONDUCTOR COOLING DEVICE BY VAPORIZING A REFRIGERATION FLUID

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