JPS5791594A - Method of plating through hole with copper - Google Patents

Method of plating through hole with copper

Info

Publication number
JPS5791594A
JPS5791594A JP16818480A JP16818480A JPS5791594A JP S5791594 A JPS5791594 A JP S5791594A JP 16818480 A JP16818480 A JP 16818480A JP 16818480 A JP16818480 A JP 16818480A JP S5791594 A JPS5791594 A JP S5791594A
Authority
JP
Japan
Prior art keywords
plating
copper
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16818480A
Other languages
Japanese (ja)
Inventor
Seiichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Priority to JP16818480A priority Critical patent/JPS5791594A/en
Publication of JPS5791594A publication Critical patent/JPS5791594A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP16818480A 1980-11-29 1980-11-29 Method of plating through hole with copper Pending JPS5791594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16818480A JPS5791594A (en) 1980-11-29 1980-11-29 Method of plating through hole with copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16818480A JPS5791594A (en) 1980-11-29 1980-11-29 Method of plating through hole with copper

Publications (1)

Publication Number Publication Date
JPS5791594A true JPS5791594A (en) 1982-06-07

Family

ID=15863337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16818480A Pending JPS5791594A (en) 1980-11-29 1980-11-29 Method of plating through hole with copper

Country Status (1)

Country Link
JP (1) JPS5791594A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283225A (en) * 1994-04-07 1995-10-27 Nippondenso Co Ltd Circuit board with bump electrodes
JP2009014693A (en) * 2007-07-09 2009-01-22 Nagoya Electric Works Co Ltd Radiation inspection method and radiation inspection apparatus for multilayer wiring board, and radiation inspection program for realizing radiation inspection method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49135832A (en) * 1972-12-14 1974-12-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49135832A (en) * 1972-12-14 1974-12-27

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283225A (en) * 1994-04-07 1995-10-27 Nippondenso Co Ltd Circuit board with bump electrodes
JP2009014693A (en) * 2007-07-09 2009-01-22 Nagoya Electric Works Co Ltd Radiation inspection method and radiation inspection apparatus for multilayer wiring board, and radiation inspection program for realizing radiation inspection method

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