JPS5796557A - Cooling supporting base for semiconductor substrate - Google Patents

Cooling supporting base for semiconductor substrate

Info

Publication number
JPS5796557A
JPS5796557A JP55172085A JP17208580A JPS5796557A JP S5796557 A JPS5796557 A JP S5796557A JP 55172085 A JP55172085 A JP 55172085A JP 17208580 A JP17208580 A JP 17208580A JP S5796557 A JPS5796557 A JP S5796557A
Authority
JP
Japan
Prior art keywords
cooling
jacket
heat
semiconductor substrate
baffle plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55172085A
Other languages
Japanese (ja)
Inventor
Toru Watanabe
Yasuharu Suzuki
Fumio Fukino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55172085A priority Critical patent/JPS5796557A/en
Publication of JPS5796557A publication Critical patent/JPS5796557A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Abstract

PURPOSE:To improve the efficiency of cooling by lengthening a flowing distance of a cooling medium. CONSTITUTION:In the cooling supporting base, an upper surface of a jacket 11 thereof, where the cooling medium, flows and cools functions as a semiconductor substrate base surface 11c and which executes working with the generation of heat to the semiconductor substrate 3, baffle plates 13a, 13b... are mounted into a passage of the cooling medium. Cooling water enters the jacket 11 from an inner pipe 12a of a double pipe 12, and is jetted radially. The cooling water meanders between a ceiling surface and the bottom by means of the baffle plates 13a, 13b..., and reaches an outer circumference while exchanging heat. Water collected to an outer pipe 12b of the double pipe 12 is cooled by means of a heat exchanger 15 owing to a pump 14, sent into the jacket 11 again through the inner pipe 12a, and the circulation is repeated. Accordingly, heat is excellently exchanged because a chance contacting with the ceiling plate of the jacket is increased and heat conduction by the baffle plates is improved.
JP55172085A 1980-12-08 1980-12-08 Cooling supporting base for semiconductor substrate Pending JPS5796557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55172085A JPS5796557A (en) 1980-12-08 1980-12-08 Cooling supporting base for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55172085A JPS5796557A (en) 1980-12-08 1980-12-08 Cooling supporting base for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5796557A true JPS5796557A (en) 1982-06-15

Family

ID=15935257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55172085A Pending JPS5796557A (en) 1980-12-08 1980-12-08 Cooling supporting base for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5796557A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
JPH0730027A (en) * 1993-07-12 1995-01-31 Dainippon Screen Mfg Co Ltd Cooling device of board
WO2012154490A1 (en) * 2011-05-11 2012-11-15 Memc Singapore Pte, Ltd. Directional solidification furnace heat exchanger
TWI405944B (en) * 2010-12-30 2013-08-21 Kinik Co Heat dissipation device
TWI566675B (en) * 2013-08-12 2017-01-11 宏碁股份有限公司 Cyclic cooling module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
JPH0730027A (en) * 1993-07-12 1995-01-31 Dainippon Screen Mfg Co Ltd Cooling device of board
TWI405944B (en) * 2010-12-30 2013-08-21 Kinik Co Heat dissipation device
WO2012154490A1 (en) * 2011-05-11 2012-11-15 Memc Singapore Pte, Ltd. Directional solidification furnace heat exchanger
US9139931B2 (en) 2011-05-11 2015-09-22 Memc Singapore Pte. Ltd. Directional solidification furnace heat exchanger
TWI566675B (en) * 2013-08-12 2017-01-11 宏碁股份有限公司 Cyclic cooling module

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