JPS579698B2 - - Google Patents

Info

Publication number
JPS579698B2
JPS579698B2 JP11177177A JP11177177A JPS579698B2 JP S579698 B2 JPS579698 B2 JP S579698B2 JP 11177177 A JP11177177 A JP 11177177A JP 11177177 A JP11177177 A JP 11177177A JP S579698 B2 JPS579698 B2 JP S579698B2
Authority
JP
Japan
Prior art keywords
oxide film
solder
soldering
perforated material
perforated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11177177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5445575A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11177177A priority Critical patent/JPS5445575A/ja
Publication of JPS5445575A publication Critical patent/JPS5445575A/ja
Publication of JPS579698B2 publication Critical patent/JPS579698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP11177177A 1977-09-17 1977-09-17 Manufacture for semiconductor device Granted JPS5445575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11177177A JPS5445575A (en) 1977-09-17 1977-09-17 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11177177A JPS5445575A (en) 1977-09-17 1977-09-17 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5445575A JPS5445575A (en) 1979-04-10
JPS579698B2 true JPS579698B2 (it) 1982-02-23

Family

ID=14569747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11177177A Granted JPS5445575A (en) 1977-09-17 1977-09-17 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5445575A (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165116A (en) * 1979-06-11 1980-12-23 Ando Screen Seisakusho:Kk Brush driving device of screen for solid-liquid separation
JP5031866B2 (ja) 2010-05-12 2012-09-26 株式会社エス・アール・エム技術開発 ウェッジワイヤースクリーン装置

Also Published As

Publication number Publication date
JPS5445575A (en) 1979-04-10

Similar Documents

Publication Publication Date Title
GB2109418B (en) Soldering device with flux exhibiting colour temperature change
JPS579698B2 (it)
JPS5483374A (en) Chip bonding process
JPS6460361A (en) Melting device
JPS5791528A (en) Manufacture of semiconductor device
JPS5429555A (en) Heat sink constituent
JPS54111766A (en) Coupling construction of lead and heat sink in semiconductor device
JPS57171570A (en) Production of vessel having connecting pipe in refrigerator
JPS6454740A (en) Integrated circuit and manufacture thereof
JPS53124072A (en) Semiconductor device
JPS5512730A (en) Semiconductor device
JPS54119876A (en) Manufacture for semiconductor device
JPS5372458A (en) Fixing method for semiconductor substrate
JPS54146251A (en) Formed brazing filler metal
JPS56114338A (en) Semiconductor device
JPS5640267A (en) Pretinning method for flat lead
JPS54140470A (en) Semiconductor device
JPS5626444A (en) Manufacture of semiconductor device
JPS55148434A (en) Fixing method of semiconductor pellet
JPS57106042A (en) Manufacture of semiconductor element
JPS5413774A (en) Production of semiconductor devices
JPS56139276A (en) Soldering device
JPS57197843A (en) Lead pin for integrated circuit device
JPS5750440A (en) Bonding device for inner lead
JPS5413262A (en) Semiconductor device