JPS5797635A - Die bonding - Google Patents

Die bonding

Info

Publication number
JPS5797635A
JPS5797635A JP55175058A JP17505880A JPS5797635A JP S5797635 A JPS5797635 A JP S5797635A JP 55175058 A JP55175058 A JP 55175058A JP 17505880 A JP17505880 A JP 17505880A JP S5797635 A JPS5797635 A JP S5797635A
Authority
JP
Japan
Prior art keywords
works
die bonding
bonding position
work feeding
exist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55175058A
Other languages
English (en)
Inventor
Masayuki Shimura
Yoshimitsu Terakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP55175058A priority Critical patent/JPS5797635A/ja
Publication of JPS5797635A publication Critical patent/JPS5797635A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
JP55175058A 1980-12-11 1980-12-11 Die bonding Pending JPS5797635A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55175058A JPS5797635A (en) 1980-12-11 1980-12-11 Die bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55175058A JPS5797635A (en) 1980-12-11 1980-12-11 Die bonding

Publications (1)

Publication Number Publication Date
JPS5797635A true JPS5797635A (en) 1982-06-17

Family

ID=15989489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55175058A Pending JPS5797635A (en) 1980-12-11 1980-12-11 Die bonding

Country Status (1)

Country Link
JP (1) JPS5797635A (ja)

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